Abstract: The method for making microfluidic connections includes the steps of providing a system including a base, a movable device in communication with the base, and a sealing component attached to the movable device; delivering a microfluidic device to the base; aligning the sealing component and the microfluidic device, wherein the moveable device is capable of adjustably positioning the sealing component and capable of optical alignment, to bring the sealing component and the microfluidic device into fluid communication; and compressing the sealing component and the microfluidic device into contact thereby forming a microfluidic connection by creating a leak-resistant seal between at the interface of the sealing component and the microfluidic device.

Abstract: The invention provides for fluidic connections to be established between tubes, ports, fluidic components and fluidic devices. The leak-tight connections are formed through controlled, compressive forces and can be used for both low and high pressure applications.

Abstract: The invention allows for the formation of robust, reproducible, non-permanent connections to microchips. The connections are formed using either indexing arms or multiple fitting holder heads which are capable of forming a compression seal to a port located at any position on the surface of the microchip. The sealing force is user-defined and can be tightly controlled with integrated force sensors. In addition, the sealing force is monitored with a force sensor and force compensation mechanism ensuring that the desired force is maintained. The device is compatible with all microchip architectures. Alterations to the microchip surface is avoided as connections are established using instrumentation rather than processing steps. Further, the process is automatable allowing for exchanging microchips and subsequently creating electrical and fluidic connections in an automated fashion. Optionally, the integration of leak sensors to monitor leaks are included.

Abstract: A chromatography and fluidic device with connections capable of automated component changing, diagnostic leak and current sensing. The chromatography-electrospray device contains a chromatography column, a pre-column, a spray emitter, or other fluidic component imbedded within one or more inserts. The inserts are robotically placed in receiving hardware, and a “plug and play” compression fitting connection mechanism makes the fluidic seals in an automated fashion. A plurality of sensors capable of detecting leaks is situated in the device near leak-prone regions. The electrospray emitter has a current sensing electrode in proximity of the electrospray region, capable of detecting the electrospray current. In conjunction with an electronics system, these sensors allow for system and component diagnostics. The diagnostic information may then be used for manual or automated system repair.

Abstract: A multi-column packing system and packed bed assessment system for producing small bore LC columns of superior quality, improved column-to-column reproducibility, and lower cost than current commercially available columns. The process utilizes an automated multi-column packing system with an integrated sensor that detects when the slurry-packed bed has reached the desired length. The optical packed bed assessment system examines the packed bed within the column and detects any packing inconsistencies or voids within the column. The multi-column packing system makes automated connections to tubes via an automated compression mechanism.