Abstract: The present embodiments provide apparatuses, systems and methods of manufacturing surface mountable devices. Some embodiments provide surface mount devices that comprise a casing comprising a recess formed in the casing and extending into the casing, an insert secured with the casing and extending about the recess defining a portion of a surface of the recess with the insert comprising a reflective surface exposed along the recess, and a plurality of leads partially exposed through the recess.

Abstract: Some embodiments provide surface mount devices that include a first electrode comprising a chip carrier part, a second electrode disposed proximate to the chip carrier part, and a casing encasing a portion of the first and second electrodes. The first electrode can extend from the chip carrier part toward a perimeter of the casing, and the second electrode can extend away from the chip carrier part and projects outside of the casing. In extending away from the chip carrier part the first electrode divides into a plurality of leads separated by an aperture that join into a single first joined lead portion with a first width before projecting outside of the casing and maintains the first width outside of the casing. The second electrode can attain a second width prior to projecting outside of the casing and maintains the second width outside the casing.

Abstract: The present embodiments provide surface mount devices and/or systems. In some embodiments, the surface mount devices comprise a casing with a recess in a second surface; a first lead element partially encased by the casing comprising a coupling portion extending interior to the casing generally in a first direction and a chipset portion extending from the first coupling portion at a first acute angle and through an area exposed by the recess; a second lead element partially encased by the casing comprising a second coupling portion extending interior to the casing in a second direction substantially parallel to the first direction and a head portion extending from the second coupling portion at a second acute angle and partially terminating interior to the area exposed by the recess; and the chipset portion comprises a first indentation and a second indentation both extending into the area exposed through the recess.

Abstract: Light emitting diode (LED) packages are made by first providing a platelike frame having a plurality of cells, each of which is composed of a main plate and a separate arm. Secondly, an LED die and a reflecting ring are respectively mounted on top of each main plate such that the die is located at a center of the reflecting ring. Then a conductive wire is connected between the top surface of the die and a top surface of the separate arm by wire bonding. A domed transparent encapsulant is then molded on each of the cells. The encapsulant encapsulates the die, the reflecting ring and the conductive wire and covers the main plate and the separate arm, and fills a space between the main plate and the separate arm to remain their spaced apart. Finally, the frame is cut according to the size of each cell to obtain the LED packages.

Abstract: This invention relates to a surface mountable light emitting device in which the lead frame is exposed over a substantial portion of the underside of the device so as to allow greater thermal conductivity to any device on which it may be mounted. The LED provides the lens and a molded body to encapsulate the lead frame and an electrical contact in a single molding step while the lead frames and further contacts are arranged in a suitable array. The lens couples the luminous output of a light-emitting diode (LED) to a predominantly spherical pattern comprises a transfer section that receives the LED's light within it and an ejector atop it that receives light from the transfer section and spreads it spherically. Applications may include, but are not limited to, household light bulbs and car headlights.

Abstract: Light emitting diode (LED) packages are made by first providing a platelike frame having a plurality of cells, each of which is composed of a main plate and a separate arm. Secondly, an LED die and a reflecting ring are respectively mounted on top of each main plate such that the die is located at a center of the reflecting ring. Then a conductive wire is connected between the top surface of the die and a top surface of the separate arm by wire bonding. A domed transparent encapsulant is then molded on each of the cells. The encapsulant encapsulates the die, the reflecting ring and the conductive wire and covers the main plate and the separate arm, and fills a space between the main plate and the separate arm to remain their spaced apart. Finally, the frame is cut according to the size of each cell to obtain the LED packages.