Abstract: A micro-relay that overcomes some of the limitations and drawbacks of the prior art is disclosed. The micro-relay comprising: (1) a first substrate comprising one or more monolithically integrated planar coils for generating a magnetic field; and (2) a second substrate comprising a magnetically actuated switch having a moving contact that selectively moves in a plane parallel to its substrate. The first and second substrate are aligned and bonded to collectively provide a closed magnetic circuit that efficiently channels the generated magnetic field through the switch.

Abstract: A micro-relay that overcomes some of the limitations and drawbacks of the prior art is disclosed. The micro-relay comprising: (1) a first substrate comprising one or more monolithically integrated planar coils for generating a magnetic field; and (2) a second substrate comprising a magnetically actuated switch having a moving contact that selectively moves in a plane parallel to its substrate. The first and second substrate are aligned and bonded to collectively provide a closed magnetic circuit that efficiently channels the generated magnetic field through the switch.

Abstract: This invention relates to reed switches, and more particularly to micro-miniaturized reed switches and batch microfabrication techniques used to fabricate micro-miniaturized reed switches. The present invention can provide miniaturized reed switches with more consistent operating parameters, and that can be produced more efficiently than conventional reed switches. The present invention can also provide methods of making miniaturized reed switches using microfabrication techniques. The present invention can use lithographic-based fabrication to enable monolithic construction of a reed switch. Microlithography can repeatedly form micrometer dimensions with tight tolerances over large arrays of devices which, if the patterns are translated into materials appropriate for electromechanical devices, can provide for repeatable and consistent electromechanical operation.

Abstract: The improved reed relay package provided a “pseudo” Form C relay that includes two Form A relays with at least one bridge filter element electrically interconnecting the signal outputs thereof to reduce stub capacitance and improve RF performance. As a result, the reed relay package can operate at very high frequencies, such as 18 GHz and higher. Also, vias can be provided through the support substrate to simulate a co-planar waveguide and RF shields profiled with cut-outs to better simulate a 50 ohm impedance environment throughout the path of the signal line.

Abstract: The improved reed relay package provided a “pseudo” Form C relay that includes two Form A relays with at least one bridge filter element electrically interconnecting the signal outputs thereof to reduce stub capacitance and improve RF performance. As a result, the reed relay package can operate at very high frequencies, such as 18 GHz and higher. Also, vias can be provided through the support substrate to simulate a co-planar waveguide and RF shields profiled with cut-outs to better simulate a 50 ohm impedance environment throughout the path of the signal line.