Patents Assigned to Covergence Technologies Limited
  • Vapor augmented heatsink with multi-wick structure
    Patent number: 7650931
    Abstract: A heat transfer device includes a base chamber, a fin chamber, and at least one fin. The chambers can be thermally coupled. The heat transfer device also includes a wick structure. The wick structure can include a multi-wick structure. The multi-wick structure can include a three-dimensional wick structure and/or a spatially varying wick structure.
    Type: Grant
    Filed: June 9, 2008
    Date of Patent: January 26, 2010
    Assignee: Covergence Technologies Limited
    Inventor: Wing Ming Siu