Abstract: An LED lamp with replaceable power supply includes a tubular body, a light module, a power supply, and two power connectors. The light module is disposed within the tubular body. The light module includes a circuit board and a plurality of LEDs. The LEDs are electrically coupled to the circuit board and are disposed on the bottom side of the circuit board. The power supply is replaceably disposed on the light module and is electrically coupled to the circuit board. The two power connectors are respectively coupled to the two ends of the tubular body and are electrically coupled to the power supply.

Abstract: A juxtaposing structure for the heated ends of a plurality of heat pipes includes a plurality of heat pipes and a locking unit. Each heat pipe has a heated end. The surface of the heated end of each heat pipe has an upper plane and a lower plane facing to each other and sidewall faces formed between both sides of the two planes. Sidewall faces of any two adjacent heat pipes adjoin and abut against each other. The locking unit locks the heated end of each heat pipe to form into one body. With the combination of each lower plane, a heated surface having a larger area can be formed.

Abstract: A high thermal conductivity thermal interface material compound includes 53% by weight of polyethylene glycol, 42% by weight of silicon carbide, and 5% by weight of lithium ions. The method of fabricating the thermal interface material includes the steps of: filling the above-described compound in a container and blending them to form aggregative compound by a blender; mixing the compound by a rolling machine to disperse the aggregative compound and filling the compound to another container; blending the compound and breaking the air bubble generated thereof, and pumping the air out of the container by a vacuum pump at the same time, to fabricate the high thermal conductivity thermal interface material compound without air bubbles.

Abstract: An isothermal plate assembly with predetermined shape and method for manufacturing the same are proposed. An upper plate and a lower plate with predetermined shape are provided and an accommodation space is defined therein. A flattened heat pipe is bent into the predetermined shape and placed into the accommodation space. A binding agent is applied on the face between the heat pipe, the upper plate and the lower plate. The upper plate and the lower plate are assembled and then a hot melting process is executed. The resultant product is then cooled to form a finished isothermal plate assembly with predetermined shape.

Abstract: A heat-dissipating device with an isothermal plate assembly of predetermined shape and method for manufacturing the same are proposed. An upper plate and a lower plate with predetermined shape are provided and an accommodation groove is defined therein. A flattened heat pipe is bent into the predetermined shape and placed into the accommodation space. A binding agent is applied on the face between the heat pipe, the upper plate and the lower plate. A heat-dissipating unit composed of a plurality of heat-dissipating fins is assembled to a concave portion of the isothermal plate assembly of the predetermined shape. The upper plate and the lower plate are assembled with outer coupling unit and then a hot melting process is executed. The resultant product is then cooled to form a finished heat-dissipating device with an isothermal plate assembly of predetermined shape.

Abstract: A heat dissipating device with uniform heat points, having a first heat sink, a second heat sink and at least two heat pipes. The second heat sink is aligned over the first heat sink. Each heat pipe has a heat absorbing portion and a heat dissipating portion. The heat absorbing and dissipating portions of each heat pipe are in thermal communication with the first and second heat sinks, respectively. The distance between two neighboring heat absorbing portions is smaller than the distance between the heat pipe and the heat sink. Thereby, the heat absorbing portions are concentrated to absorb heat generated by a heat source, and the heat dissipating portions are distributed over a larger area to effectively dissipate the heat.

Abstract: An integrated heat dissipating device has a heat sink, a first set of fins, a second set of fins and at least one heat pipe. The heat sink has a thermal conductive block embedded therein and a through hole exposing the thermal conductive block from a top surface of the heat sink. The first set of fins has a plurality of horizontally extending fins stacked with each other along a vertical direction over the heat sink. The second set of fins is integrated by a plurality of vertically extending fins arranged in a curved shape between the heat sink and the first set of fins. The heat pipe has a vertical extension across the first set of fins and a horizontal extension underneath a bottom of the first set of fins. The horizontal extension is inserted into the through hole in contact with the thermal conductive block.

Abstract: A dual-layer heat dissipating structure includes a first heat sink, a second heat sink, and a heat pipe with a connecting portion and a curved portion, interconnecting the first and second heat sinks for thermal conduction. The first and second heat sinks each has a substrate and exterior fins protruding from two opposing ends thereof. Two substrates each includes at least one slot through out of two corresponding end plates of the same side for locating the connecting portion, and the corresponding end plates each includes an opening with respect to the slot for partially moving in the curved portion. The exterior fins of the first and second heat sinks are aligned with each other, and a snap-type connecting structures are formed on terminuses of the exterior fins. The second and first heat sinks are connected to each other by the snap-type structure, and the connection joint is reinforced by implanting soldering material.

Abstract: An integrated heat dissipation apparatus, having a first heat dissipating element, a second heat dissipating element, a thermal conductive heat sink and at least one L-shape heat pipe. The thermal conductive heat sink has a connecting surface and a thermal conductive surface opposing the connecting surface. The first heat dissipating element is mounted on the thermal conductive surface. A plurality of thermal conductors with thermal conductivity larger than that of the thermal conductive heat sink are mounted to the connecting surface. The L-shape heat pipe has two ends, including one end serial connecting to the second heat dissipating element, and the other end extending to connect with the thermal conductors on the thermal conductive heat sink.