Abstract: A method of providing a contactless card having a metal substrate with a first and second, a top and bottom face. A slit can be created in the creating a slit in the metal substrate wherein the slit has ends extending to the edges of the substrate. The method includes filling the slit with a central fill filler material wherein the central fill defines a top void between the central fill and a top plane relative to a top face of the substrate and the central fill defines a bottom void between the central fill and a bottom plane relative to a bottom face of the substrate. The filler material of the central, top, and bottom portions is cured and planned to be flush with the substrate front and back surfaces. The filler material can be a resin and the slit can have generally an “S” configuration or portion thereof.