Abstract: Solid state light engines are disclosed that emit a bright, non-symmetrical emission pattern, with a relatively high luminous flux and from a relatively small area. The light engines can be used in many different types and sizes of light sources, with some embodiments providing a light quantity, quality and distribution similar to conventional J-type Halogen light sources. The light engines are arranged with integral power supplies and heat management features that allow for the engines to provide high emission intensities while generating significantly less heat at the light source. This can result in significantly higher efficiency and greater life space. In some embodiments, the light can perform similarly to a halogen J-type Lamp 80 mm light tube, while generating similar or greater amounts of light. The light engines according to the present invention provide the capability to be used in low profile light fixtures.

Abstract: The present invention is directed to LED packages and LED displays utilizing water resistant packages with improved structural integrity and customizable attributes. In some embodiments, the improved structural integrity is provided by various features in the lead frame that the casing material encompasses to improve the adhesion between the lead frame and the casing for a stronger, water resistant package. Moreover, in some embodiments the improved structural integrity and water resistance is further provided by cavity features that improve adhesion between the cavity and a protective encapsulant. Some embodiments also provide for packages with a greater overall height than the length of their side-exposed solder pins, which improves gel coverage of the side-exposed solder pins between adjacent packages.

Abstract: The present invention relates to different embodiments of lighting fixtures, such as troffers. A lens can be placed between a light engine and a reflector and secured in place by crimping portions of the light engine, reflector, or both to prevent the lens from moving. Troffers according to the present invention can lack a dedicated heat sink, instead sufficiently dissipating heat through the light engine. This can significantly reduce the weight of the troffer. Emitter panels can be directly mounted on a light engine inner surface, or on an internal reflector within the light engine.

Abstract: Solid state light engines are disclosed that emit a bright, non-symmetrical emission pattern, with a relatively high luminous flux and from a relatively small area. The light engines can be used in many different types and sizes of light sources, with some embodiments providing a light quantity, quality and distribution similar to conventional J-type Halogen light sources. The light engines are arranged with integral power supplies and heat management features that allow for the engines to provide high emission intensities while generating significantly less heat at the light source. This can result in significantly higher efficiency and greater life space. In some embodiments, the light can perform similarly to a halogen J-type Lamp 80 mm light tube, while generating similar or greater amounts of light. The light engines according to the present invention provide the capability to be used in low profile light fixtures.

Abstract: A multi-chip lighting module is disclosed for maximizing luminous flux output and thermal management. In one embodiment, a multi-chip module device comprises a substantially thermally dissipative substrate with a dark insulating layer deposited on a surface of the substrate. A plurality of light emitting devices is also provided. An electrically conductive layer is applied to a surface of the substrate, with the conductive layer comprising a plurality of chip carrier parts each having a surface for carrying at least one of the light emitting devices. Each light emitting device has a first and a second electrical terminal. A reflective layer is also provided that at least partially covers the conductive layer.

Abstract: The present invention is directed to LED packages and LED displays utilizing the LED packages, wherein the LED chips within the packages are arranged in unique orientations to provide the desired package or display FFP. One LED package according to the present invention comprises a reflective cup and an LED chip mounted in the reflective cup. The reflective cup has a first axis and a second axis orthogonal to the first axis, wherein the LED chip is rotated within the reflective cup so that the LED chip is out of alignment with said first axis. Some of the LED packages can comprise a rectangular LED chip having a chip longitudinal axis and an oval shaped reflective cup having a cup longitudinal axis. The LED chip is mounted within the reflective cup with the chip longitudinal axis angled from the cup longitudinal axis.

Abstract: The present embodiments provide surface mount devices and/or systems. In some embodiments, the surface mount devices comprise a casing with a recess in a second surface; a first lead element partially encased by the casing comprising a coupling portion extending interior to the casing generally in a first direction and a chipset portion extending from the first coupling portion at a first acute angle and through an area exposed by the recess; a second lead element partially encased by the casing comprising a second coupling portion extending interior to the casing in a second direction substantially parallel to the first direction and a head portion extending from the second coupling portion at a second acute angle and partially terminating interior to the area exposed by the recess; and the chipset portion comprises a first indentation and a second indentation both extending into the area exposed through the recess.

Abstract: Some embodiments provide surface mount devices that include a first electrode comprising a chip carrier part, a second electrode disposed proximate to the chip carrier part, and a casing encasing a portion of the first and second electrodes. The first electrode can extend from the chip carrier part toward a perimeter of the casing, and the second electrode can extend away from the chip carrier part and projects outside of the casing. In extending away from the chip carrier part the first electrode divides into a plurality of leads separated by an aperture that join into a single first joined lead portion with a first width before projecting outside of the casing and maintains the first width outside of the casing. The second electrode can attain a second width prior to projecting outside of the casing and maintains the second width outside the casing.