Abstract: A method and apparatus for imaging an overlying conductive pattern over an underlying conductive pattern on a substrate, by determining deviations between the actual locations and the nominal locations of predetermined reference targets in the underlying conductive pattern on the substrate; and utilizing the determined deviations for modifying the scanning control data used for imaging the image data of the overlying conductive pattern in order to reduce misregistration thereof with respect to the underlying conductive pattern. Preferably, the reference targets are predetermined connection sites in the underlying conductive pattern to be precisely located with respect to connection sites in the overlying conductive pattern. The reference features may be assigned different weights according to their registration importance, and the deviations may be determined according to a threshold which varies with the weight assigned to the respective reference feature.

Abstract: A method and apparatus for printing a pattern on a substrate, by applying a photoresist layer over the substrate; locating a laser direct-imagining exposure head to print the pattern on the substrate by the application of one or more laser beams to the photoresist layer on the substrate while relative movement is effected between the exposure head and the substrate; and controlling the drive and the exposure head to cause the exposure head to print a first portion of the pattern on a first portion of the substrate at a first (normal) resolution, and a second portion of the pattern on a second portion of the substrate at a second (higher) resolution.

Abstract: A method and apparatus for controlling a processing machine to perform a processing operation on a workpiece by (a) determining the nominal locations of at least two sensible reference marks on the workpiece in terms of the coordinates of the workpiece; (b) loading the workpiece on the processing machine; (c) sensing, and measuring the actual locations of, the reference marks on the workpiece when so mounted, in terms of the coordinates of the processing machine; (d) determining at least one geometrical transformation needed to transform the workpiece coordinates of the nominal locations of the reference marks to the processing machine coordinates of the actual locations of the reference marks; (e) and controlling the processing machine in accordance with the determined geometrical transformation.

Abstract: The present invention relates to a process for the fabrication of multilayer articles having electrical connections between conductor patterns on at least two layers of the multilayer article.