Abstract: A high density electrical connector is shown in which discrete dielectric wafers mount several contact elements within grooves on a first surface of the wafer while mounting a single ground plane within a recess on a second surface. This configuration, when the wafers are stacked side-by-side, forms the contacts in a stripline connection in which the impedance of each contact may be controlled. The wafers may be inserted into slots within a housing to form a high density connector for joining a daughter board to a mother board.

Abstract: The anodizing clip includes an elongate body having inner and outer surfaces. The inner surface has teeth at either end. A flexible, strong elastic band has first and second ends removably secured to the body and sized to pass around a rack member of an anodizing rack. A workpiece is placed between the teeth of the body and the rack member and is held in place by the force of the elastic band. Insertion and removal of workpieces between the rack member and the teeth on the body of the anodizing clip is preferably accomplished using a release tool to gain a mechanical advantage.