Abstract: A molding process according to one embodiment of the present disclosure includes injecting a first molding material into a mold cavity of a mold, the mold cavity formed by at least a mold cavity portion of a first platen and a second platen when the first platen is in contact with the second platen; opening the mold by separating the first and second platens; placing a second molding material at the first molding material while the first molding material remains with the first platen or the second platen; sealing a space between the first and second platens; removing a gas from the space while the space is sealed; and closing the mold while the space is sealed.