Abstract: A method for plating first selected surfaces of a platable plastic substrate without plating second selected surfaces is disclosed. The method comprises first electrolessly plating the substrate to provide an electroless metal layer over all of the first selected surfaces and at least a portion of the second selected surfaces. The substrate is then mounted on an electroplating rack so that the current density at the second selected surfaces is lower during electroplating than at the first selected surfaces. The substrate is then electroplated to provide one or more intermediate metal layers which extends over at least all of the first selected surfaces and then electroplated with a final metal different from the metals of the electroless and intermediate layers at a voltage whereby the final metal deposits over the first selected surfaces but not over the second selected surfaces.

Abstract: Mixtures of water with water soluble and/or miscible halogenated compounds are used to pre-etch polysulfone and other polymers such as polyesters and polycarbonates to induce or improve adhesion of metals deposited by electroless plating processes.