Abstract: A plastic hubcap assembly comprises an annular anchor adapted to be fixedly mounted on the outer surface of an automobile wheel. A retaining ring is rotatably mounted on the anchor and secured by a releasable latch mechanism which prevents loosening of the retaining ring. A decorative cover, preferably made of a platable plastic, is fixedly mounted over the retaining ring.

Abstract: A platable plastic product substrate assembly comprises at least one overflow assembly having a primary support, at least one secondary support extending from the primary support and at least one clip for engaging the framework of a plating rack. A product substrate is removably attached to each secondary support.

Abstract: A platable plastic product substrate assembly is disclosed. The product substrate assembly comprises a runner system having at least one runner and at least one clip for engaging the framework of a plating rack. A plurality of product substrates are removably attached to gates with clip protruding from the runner.

Abstract: Polyamide substrates are pre-conditioned for electroless plating by contact with an aqueous alkaline solution having a pH of at least about 10 and etched with an aqueous acid etch solution of an organic acid containing at least two carbon atoms, in combination with from 1 to 10 percent by weight of an inorganic acid which is nondeleteriously reactive with the organic acid. Trichloroacetic acid is the preferred organic acid and sulfuric, hydrochloric and/or nitric the preferred inorganic acids. Contact with the aqueous alkaline solution can be eliminated where the polyamide is caprolactam.

Abstract: Filled polycarbonate resin substrates are conditioned for electroless plating by contact with an alkaline conditioner having a pH of at least 8, followed by contact with an aqueous acid fluoride etch solution having a pH less than about 5 and a fluoride concentration of at least 1 mole per liter of solution.

Abstract: Filled polyester substrates are conditioned for electroless plating by contact with an alkaline conditioner having a pH of at least 8, followed by contact with an aqueous acid fluoride etch solution having a pH less than about 5 and a fluoride concentration of at least 1 mole per liter of solution.

Abstract: Polyamide substrates are pre-conditioned for electroless plating by contact with an alkaline aqueous solution having a pH of at least about 10 and etched with an aqueous acid etch solution. The aqueous acid etch solution is preferably an aqueous solution of an organic acid containing at least two carbon atoms, particularly an acetic acid compound, such as trichloroacetic acid.

Abstract: Caprolactam polymeric substrates are conditioned for electroless plating by etching with an aqueous solution of organic acid containing from 2 to 4 carbon atoms, preferably an acetic acid compound, such as trichloroacetic acid.