Abstract: An aqueous noble metal suspension capable of one stage activation of the surface of a nonconductor for electroless plating is provided by reducing a noble metal ion in an aqueous solution of a noble metal salt with a non-complexing reducing agent for the noble metal ion in the presence of a water soluble organic suspending agent.The particulate noble metal is rapidly absorbed by a nonconducting surface over a broad range of operating temperatures when the suspension is maintained at a pH below 3.5.
Abstract: Water soluble salts of metals other than the noble metals, such as copper and nickel salts, are converted in the presence of a water soluble suspending agent to suspensions of water insoluble catalytic particles which are absorbable onto the surface of nonconductors to permit electroless plating of the surfaces.
Type:
Grant
Filed:
April 22, 1974
Date of Patent:
May 18, 1976
Assignee:
Crown City Plating Company
Inventors:
Lawrence P. Donovan, Eileen Maguire, Leon A. Kadison