Abstract: An improved shielding assembly for a circuit board. This assembly is formed by providing a substantially flat piece of metal that will be used to form a shield assembly. A template is obtained indicating locations of folds and tabs. The folds are at locations that will enable the tabs to be located in the holes on the circuit board. The template is used to etch grooves and to etch tabs. This can be used to form a shielding assembly.

Abstract: An improved shielding assembly for a circuit board. The assembly includes a multi-layer circuit board, each layer of which has ground planes around the perimeter thereof. An edge plating on the circuit board connects the ground planes to one another. A number of tab holes are also in the board, and the shielding assembly is formed as a conductive box which is connected to the tab holes. A shielded area is formed within the shielding assembly. The shielding assembly is preferably formed by etching fold locations and folding, and by etching tabs to be formed.