Patents Assigned to CTLAB CO. LTD.
  • Patent number: 9773950
    Abstract: The present disclosure relates to a method for manufacturing a semiconductor device structure, comprising the steps of: securing the position of a semiconductor device on a plate; securing the positions of electrodes such that the electrodes face the plate; covering the semiconductor device with an encapsulating material; and separating, from the plate, the semiconductor device covered with the encapsulating material.
    Type: Grant
    Filed: April 5, 2013
    Date of Patent: September 26, 2017
    Assignee: CTLAB CO. LTD.
    Inventors: Chang Tae Kim, Jae Sung Ko, Seok Jung Kim, Chang Hun Lee