Abstract: The present disclosure relates to a method for manufacturing a semiconductor device structure, comprising the steps of: securing the position of a semiconductor device on a plate; securing the positions of electrodes such that the electrodes face the plate; covering the semiconductor device with an encapsulating material; and separating, from the plate, the semiconductor device covered with the encapsulating material.
Type:
Grant
Filed:
April 5, 2013
Date of Patent:
September 26, 2017
Assignee:
CTLAB CO. LTD.
Inventors:
Chang Tae Kim, Jae Sung Ko, Seok Jung Kim, Chang Hun Lee