Abstract: An adhesion structure and an electronic device are provided. The adhesion structure includes a substrate and an adhesive layer. The adhesive layer is disposed on the substrate, and the adhesive layer includes a plurality of graphene microplates. A part of the graphene microplates protrude from two opposite surfaces of the adhesive layer. The thickness of the graphene microplates is greater than or equal to 0.3 nanometers and is less than or equal to 3 nanometers. The flake diameter of the graphene microplates is greater than or equal to 1 micrometer and is less than or equal to 30 micrometers. The adhesion structure can not only provide the adhesive function, but also improve the heat dissipation efficiency of electronic device.

Abstract: An elastic heat-dissipation structure comprises a porous elastic member, a plurality of first thermal conductive members, and a plurality of second thermal conductive members. The first thermal conductive members and the second thermal conductive members are mixed in the porous elastic member. Each first thermal conductive member has a maximum width ranged from 5 ?m to 50 ?m, each second thermal conductive member has a maximum width ranged from 0 ?m to 5 ?m, and the thicknesses of each first thermal conductive member and each second thermal conductive member ranges from 0.3 nm to 30 nm. When the density of the elastic heat-dissipation structure is between 0.1 g/cm3 and 1.0 g/cm3, the contained percentages of the first thermal conductive members and the second thermal conductive members range from 0.01% to 20%. An electronic device containing the elastic heat-dissipation structure is also disclosed.