Abstract: In using a photoinitiator and irradiation with UV-light suitable monomers can be selectively inoculated on the surface of a non conducting substrate in a distinct pattern. Metal ions are thereafter absorbed by these monomers and are reduced. To this pattern further conducting materials, e.g. metals, can thereafter be added in a conventional way. The method according to the invention comprises a fully additive method to produce a circuit board with high resolution and the production of functional components directly on a non conducting substrate. (FIG.