Patents Assigned to CUPTRONIC TECHNOLOGY LTD.
  • Patent number: 12378671
    Abstract: There is provided a method for treating a surface comprising heating the object and the object with a solution comprising a thermal initiator and a polymerizable molecule, wherein the polymerizable molecule reacts with the surface and forms a covalent bond and optionally a covalently bound polymer on the surface of the object. Metal ions are bound to the surface to make the surface possible for adding further metal later. Advantages include that complicated geometries can be coated, problems with oxygen inhibition of the initiator is reduced, and surface reaction to form covalent bonds is promoted compared to the bulk polymerization reaction.
    Type: Grant
    Filed: July 23, 2021
    Date of Patent: August 5, 2025
    Assignee: CUPTRONIC TECHNOLOGY LTD.
    Inventors: Sven Göthe, Björn Atthoff
  • Patent number: 10934617
    Abstract: A method for applying a metal on a substrate comprises: a) applying a coating by treatment in a plasma, comprising a compound selected from alkanes up to 10 carbon atoms, and unsaturated monomers, and b1) producing polymers on the surface of the substrate, the polymers comprising carboxylic groups and adsorbed ions of a second metal, reducing the ions to the second metal, or alternatively b2) producing polymers on the surface, bringing the surface of the substrate in contact with a dispersion of colloidal metal particles of at least one second metal, and c) depositing the first metal on the second metal. Advantages include that materials sensitive to, for instance, low pH or solvents can be coated. Substrates including glass, SiO2 with very few or no abstractable hydrogen atoms as well as polymer materials containing halogen atoms can be coated with good adhesion.
    Type: Grant
    Filed: November 16, 2011
    Date of Patent: March 2, 2021
    Assignee: CUPTRONIC TECHNOLOGY LTD.
    Inventors: Sven Göthe, Björn Atthoff, Karl-Gunnar Larsson
  • Patent number: 10822702
    Abstract: A method for application of a metal on a substrate comprises a) contacting at least a part of the surface of the substrate with at least one initiator, and polymerizable units with the ability to undergo a chemical reaction to form a polymer, the polymer comprising at least one charged group, wherein the contacting is achieved by contacting a pad with a plate comprising the at least one initiator and the polymerizable units and subsequently contacting the pad with the surface of the substrate, thereby transferring the at least one initiator and the polymerizable units to the surface of the substrate. Subsequently a metal layer is produced on the surface. The compactness of the applied metal layer is increased.
    Type: Grant
    Filed: October 28, 2016
    Date of Patent: November 3, 2020
    Assignee: CUPTRONIC TECHNOLOGY LTD.
    Inventors: Björn Atthoff, Sven Göthe
  • Patent number: 10774424
    Abstract: A method of metallizing substrate with abstractable hydrogen atoms and/or unsaturations on the surface, comprising the steps: a) contacting the substrate with a polymerizable unit, at least one initiator which can be activated by both heat and actinic radiation, and optionally at least one solvent, b) inducing a polymerization reaction c) depositing a second metal on an already applied first metal to obtain a metal coating. A first metal is added as ions and/or small metal particles during the process. Ions are reduced to the first metal. Advantages include that the adhesion is improved, the process time is shortened, blisters in the metal coating are avoided, the polymer layer below the metal coating becomes less prone to swelling for instance in contact with water.
    Type: Grant
    Filed: October 28, 2016
    Date of Patent: September 15, 2020
    Assignee: CUPTRONIC TECHNOLOGY LTD.
    Inventors: Björn Atthoff, Sven Göthe
  • Patent number: 9889471
    Abstract: A process for application of metal on a substrate surface comprises applying a mixture of a solvent, a polymerizable monomer, and a photoinitiator on a substrate surface, wherein the photoinitiator does not form two phases together with the monomer and the solvent, i.e. it forms an amorphous mixture without any crystals. The monomer is able to polymerize to a polymer comprising at least one carboxylic group. Thereafter the solvent is evaporated. Polymerization is induced by irradiating the applied dried mixture. Ions are applied and reduced to metal and thereafter further metal can be deposited. The method can be used in industrial processes, both 2D and 3D surfaces can be coated with metal. Materials sensitive to standard grafting chemicals and/or polymers containing halogen atoms can be coated.
    Type: Grant
    Filed: November 5, 2014
    Date of Patent: February 13, 2018
    Assignee: Cuptronic Technology Ltd.
    Inventors: Sven Göthe, Björn Atthoff
  • Publication number: 20140017575
    Abstract: A method for applying a metal on a substrate comprises: a) applying a coating by treatment in a plasma, comprising a compound selected from alkanes up to 10 carbon atoms, and unsaturated monomers, and b1) producing polymers on the surface of said substrate, said polymers comprising carboxylic groups and adsorbed ions of a second metal, reducing said ions to the second metal, or alternatively b2) producing polymers on the surface, bringing the surface of said substrate in contact with a dispersion of colloidal metal particles of at least one second metal, and c) depositing said first metal on said second metal. Advantages include that materials sensitive to for instance low pH or solvents can be coated. Substrates including glass, SiO2 with very few of no abstractable hydrogen atoms as well as polymer materials containing halogen atoms can be coated with good adhesion.
    Type: Application
    Filed: November 16, 2011
    Publication date: January 16, 2014
    Applicant: CUPTRONIC TECHNOLOGY LTD.
    Inventors: Sven Göthe, Björn Atthoff, Karl-Gunnar Larsson