Abstract: The conductor board has at least one layer of a dielectric provided areally on two mutually opposed faces with at least one metalization on each. There is at least one through contacting in the region of an aperture. The metalizations are applied to cover at least one aperture and are electrically connected to each other through the aperture.

Abstract: Disclosed is a metal-ceramic substrate made up of at least one ceramic layer which is provided with metallizations on both faces. In order to obtain a partial discharge resistance of less than 10 pC at a predefined measuring voltage, the thickness of the ceramic layer amounts to about one sixth of the measuring voltage.

Abstract: At least one power semiconductor component is cooled by a flat, copper, plate-type hollow body conducting a coolant fluid. Components are fixed on one flat-sided surface of the hollow body and the other flat-sided surface includes two coolant fluid openings for introducing the coolant fluid into the hollow body and for evacuating the fluid therefrom. The other flat-sided surface is concave and elastically deformable between the coolant fluid openings. The concave other surface is attached to the even surface of a support in such a way that the concave surface and the even surface are pressed against each other by the elastically planar deformation of the concave surface and that the coolant fluid openings are sealed in a fluidproof manner by O-rings. A solid strut, which interconnects the two flat-sided surfaces is additionally configured in the hollow body. The cooling device may be used in a module or an assembly including a support and the cooling device or module.

Abstract: The conductor board has at least one layer of a dielectric provided areally on two mutually opposed faces with at least one metalization on each. There is at least one through contacting in the region of an aperture. The metalizations are applied to cover at least one aperture and are electrically connected to each other through the aperture.

Abstract: A mirror for laser application and a method for manufacturing the mirror is disclosed herein. The mirror comprises several layers including a top layer used as the mirror surface. A cooling structure including a plurality of cooler layers are providing between the top layer, several intermediate layers and a bottom layer. Connections are provided for allowing a coolant to flow within the mirror. The mirror is constructed by stacking the layers on top of one another and connecting adjacent layers together by direct copper bonding or active soldering.

Abstract: A process for manufacturing a metal ceramic substratum for use as a substrate in electrical or electronic circuits or components which includes utilizing an unique form mold process. At least one blank ceramic plate is shaped in a form mold through a desired set of process steps. The steps include heating and cooling to desired temperatures at desired heat and cool rates.

Abstract: The invention relates to a novel process for producing a copper ceramic substrate with at least one through-plated hole, with a ceramic layer which has at least one opening for the through-plating, on one surface side is provided with a first metal coating and on the opposite surface side with a second metal coating which extends into at least one opening and is connected to the first metal coating, for formation of the first metal coating a copper foil being applied by DCB technique to one surface side of the ceramic layer.

Abstract: The invention relates to a novel ceramic substrate with at least one layer essentially of aluminum nitride which is provided on at least one surface side with an intermediate or auxiliary layer which contains aluminum oxide and which has a thickness in the range of 0.5-10 microns, and to a process for its production.

Abstract: The invention relates to a cooler for use as a heat sink for electrical components or circuits consisting of several cooler layers which are joined flat to one another, which are stacked on top of one another, which form between channels through which coolant flows and which each discharge into at least one first collection space for supply of the coolant and into a second collection space for draining the coolant, the collection spaces being formed by openings in the cooler layers and the cooling channels by structuring at least one area of the coolant layers with openings, the area being between the openings.

Abstract: A microcooler with channels through which coolant flows. The channels are formed by individual cooler layers having a region which is structured in the manner of a screen and having a plurality of openings with edge lines closed and with material bridges or material regions remaining between these openings. None of the openings on any of the cooler layers form a continuous channel which extends from a collection space for feed of the coolant to a collection space for drainage of the coolant. The individual breaches, and the material bridges or material regions, provided between them are offset from cooler layer to cooler layer such that flow of the coolant through the cooler is possible only with continuous changing of the layers. Using the breaches within the cooler results in a highly branched labyrinth through which coolant flows.

Abstract: A method of producing a ceramic-metal substrate, in which a cooper foil is superficially attached on at least one surface side of a ceramic layer a first metal layer formed by a metal foil, preferably a copper foil. The ceramic layer is then slit after applying the first metal layer, by removing the material of the ceramic layer down to first metal layer. At least one slit at a time is then made in the ceramic layer along at least two edges of the ceramic layer and at a distance from these edges, and extends over the entire length of the edge so that on either side of each slit there is a first ceramic layer section which has the respective adjacent edge and another ceramic layer section. The width of the slit is at least equal to twice the thickness of the ceramic layer. The metal layer is bent 180.degree.