Abstract: A metal vapor evaporator source is provided that increases productivity of a vacuum plating operation in which it is used by reducing scrap product due to spatter of liquid metal particles from the evaporator to the product, and by reducing spurious metal condensate within the vacuum chamber, the accumulation of which metal condensate is known to increase downtime of the equipment. The former is accomplished by inhibiting the generating of such particles by increasing the total pressure on the pool of molten metal and by physically intercepting many of the spattered particles that are generated despite the increased pressure. The latter is accomplished by partially collimating the beam of metal vapor, a result of intercepting and condensing the stray vapor on a radiant-heat shield that is at a temperature above the melting point of the metal.