Abstract: A method for plating metal on a dielectric material includes dipping the dielectric in a solution containing catalytic metal particles. These particles have a dipole which helps them attach to the dielectric's surface. The dielectric's surface can be roughened to make it more attractive to such particles. The dielectric material is then placed in a metal salt solution that causes metal to be plated upon the dielectric by electroless plating. A thicker metallic layer can be deposited on top of the resulting layer by electroplating. This or other methods can be used to make an electrical circuit having one or more dielectric layers comprised of latex and one or more layers of conductive leads. A multichip module can be made which includes a plurality of integrated circuits mounted on a substrate; one or more dielectric layers comprised of a flexible dielectric material; and one or more layers of electrically conductive material patterned to interconnect such ICs.

Abstract: A photolithographic system uses a mask that carries a plurality of photolithographic images. In one embodiment, the mask carries images for all the layers necessary to manufacture a variety of different device cells, which can include devices of different types. A single mask may carry the images required to make a complete system consisting of multiple devices. Some devices may comprise multiple layers. The system includes an adjustable aperture system which defines the area of the mask which will be illuminated. The mask is employed in a mask aligner which includes a source of electromagnetic radiation, apparatus to carry and position a substrate, apparatus to position the mask, and apparatus to position and adjust the aperture.