Abstract: Device is described that reduces the forces needed to release a wafer from a wet polishing surface after polishing. Device comprises attachment adapted to be mounted to a polishing apparatus to permit attachment surface, configured to mate with two regions of the wafer, to tilt relative to the polishing surface. Means for defining adhesive force between attachment surface and one of the two wafer regions, and means for defining adhesive force between attachment surface and other of the two wafer regions which is different than that defined between attachment surface and the one wafer region so as to cause a non-parallel relationship between the one wafer face and polishing surface, are provided. Unbalanced force causes a non-parallel relationship between wafer and polishing pad and facilitates separation and lifting of wafer from polishing surface.

Abstract: A holder mechanism tilts and rotates a vertically oriented wafer-loaded cassette for proper presentation in a horizontal orientation to the robotic arm of a workstation. The mechanism includes a cassette holder, a support member, and a motor. The cassette holder has first and second supports that define orthogonal first and second planes. In two embodiments, the support member connects the cassette holder to the motor shaft and, as the motor shaft rotates, the cassette holder is rotated about a single pivot axis that is oblique to the first and second planes. This rotation tilts a cassette placed in the holder through a tilt angle of about 45.degree. to 90.degree., and simultaneous rotates the cassette through an angle .theta. about the vertical axis. The support member shape determines whether tilting and rotation is away from or toward the motor, and also determines the angle of rotation .theta. and the tilt angle.

Abstract: Device and method are described that reduce the force needed to release a wafer from a wet polishing surface after polishing. Device comprises attachment, such as a wafer carrier, adapted to be mounted to a polishing apparatus to permit attachment surface, configured to mate with two regions of the wafer, to tilt relative to polishing surface. Means for defining adhesive force between attachment surface and one of the two wafer regions, and means for defining adhesive force between attachment surface and other of the two wafer regions which is different than that defined between attachment surface and the one wafer region so as to cause a non-parallel relationship between the one wafer face and polishing surface, are provided. Unbalanced force, such as a vacuum force communicated to a limited region of the surface of the carrier, causes a non-parallel relationship between wafer and polishing pad and facilitates separation and lifting of wafer from polishing surface.

Abstract: A prealigner for semiconductive wafers is described. The prealigner includes mechanism for holding the wafer in a non-slip manner and motive means for adjusting the position of its engagement with the wafer as necessary to make the geometric center of the wafer precisely coincident with a chosen position.

Abstract: A polishing head for polishing a semiconductor wafer is described. The head design enables a wafer retainer to float during polishing and yet extend beyond a wafer carrier to define a pocket for the wafer and thereby facilitate wafer changing. The head construction also enables the carrier to be selectively projected beyond the retainer so that the surface of the carrier is easily accessible for changing an insert or the like. The head uses a positive air pressure to press the wafer against the polishing pad and the head includes interfering mechanical constructions which provide the positions mentioned above.

Abstract: A robotic handling system is described that includes a support column aligned along a vertically aligned Z axis with a dual-wand assembly rotatably mounted atop the support column and defining a `reach` or R axis. Drive motor/encoder assemblies are mounted adjacent the support column for raising or lowering the dual-wand assembly along the Z axis and mounted within the support column for slewing the dual-wand assembly to any selected .theta. angle within the range of operation under the control of a stored program processor.