Abstract: A wafer-like semiconductor sensor includes a wafer-like base formed of a plurality of layers of chemically-hardened glass and an electronics module mounted to a recessed pocket in the base and containing a sensor.

Abstract: A method of determining dimensional information of a target surface includes generating a first point cloud corresponding to a first plurality of reconstructed surface points of the target surface generated by a first imaging system-illumination source pair of a phase profilometry system; generating a second point cloud corresponding to a second plurality of reconstructed surface points of the target surface generated by a second imaging system-illumination source pair of the phase profilometry system; generating an initial estimate of the target surface based on the first and second point clouds; and refining the initial surface estimate using positions of the first and second point clouds and geometry of the first and second imaging system-illumination source pairs to generate a final point cloud.

Abstract: A wireless substrate-like sensor for teaching transfer coordinates to a robotic substrate handling system is provided. The sensor includes a base portion sized and shaped like a substrate handled by the robotic substrate handling system. An electronics housing is coupled to the base portion. A power module is disposed within the electronics housing and configured to power components of the sensor. At least one edge camera is disposed near an edge of the base portion. The at least one edge camera has a field of view that images an alignment feature of the object within the field of view of the at least one edge camera of the wireless substrate-like sensor. A controller is disposed within the electronics housing and is coupled to the at least one edge camera. The controller is configured to obtain an image from the at least one edge camera and determine a location of the alignment feature and provide the determined location to the robotic substrate handling system.

Abstract: A system for generating a three-dimensional height image of a reflective target includes an illumination source configured to generate a patterned illumination on the reflective target, and an imaging system configured to acquire an image of the patterned illumination on the reflective target, the illumination source and camera being aligned relative to the target such that the camera acquires a specular image of the patterned illumination. The system further including a controller coupled to the illumination source and the camera configured to generate a first height image of the target based on the acquired image, the first height image being used by the controller to determine a position, a height, and a tilt of the target and calculate an error function based on the determination to compensate the first height image for the calculated error.

Abstract: A system for measuring solder paste stencil aperture positions and sizes is provided. The system includes at least one camera configured to acquire images of the stencil and an alignment target. A motion system generates relative motion between the at least one camera and the stencil. A controller is coupled to and controls the motion system. The controller is configured to analyze the images to generate aperture information relative to the stencil. The aperture information is provided to automatically program a solder paste inspection system. Other features and benefits that characterize embodiments of the present invention will be apparent upon reading the following detailed description and review of the associated drawings.

Abstract: A system for generating a three-dimensional height image of a reflective test target includes an illumination source configured to generate a patterned illumination on the test target, an imaging system configured to acquire an image of the patterned illumination on the test target, and a variable focus optical system configured to cause the camera to image the test target with at least two distinct focus positions, the illumination source and camera being aligned relative to the test target such that the camera acquires a specular image of the patterned illumination. The system further including a controller coupled to the illumination source, the camera and the variable focus optical system, the controller being configured to generate a height image of the test target based on the acquired image of the patterned illumination using at least two distinct focal positions.

Abstract: An optical phase profilometry system includes a first operative coaxial camera-projector pair aligned at a first angle relative to a target surface that projects a first illumination on the target surface and a second operative coaxial camera-projector pair aligned at a second angle relative to the target surface that projects a second illumination on the target surface. Wherein the first and second angles are equal and opposite to one another relative to the target surface such that the second operative coaxial camera-projector pair is configured to capture a first reflection from the first illumination and the first operative coaxial camera-projector pair is configured to capture a second reflection from the second illumination. The optical phase profilometry system further includes a controller configured to, based on the captured first and second reflections, generate a first and second estimation of the target surface and combine them to generate a dimensional profile of the target surface.

Abstract: A method of determining dimensional information of a target surface includes generating a first point cloud corresponding to a first plurality of reconstructed surface points of the target surface generated by a first imaging system-illumination source pair of a phase profilometry system; generating a second point cloud corresponding to a second plurality of reconstructed surface points of the target surface generated by a second imaging system-illumination source pair of the phase profilometry system; generating an initial estimate of the target surface based on the first and second point clouds; and refining the initial surface estimate using positions of the first and second point clouds and geometry of the first and second imaging system-illumination source pairs to generate a final point cloud.

Abstract: A single-use sensor interface for coupling a single-use container to a re-usable sensing instrument is provided. The single-use sensor interface includes a polymeric flange couplable to a wall of the single-use container. The polymeric flange has a sidewall and an interface portion configured to receive a deflectable polymeric diaphragm. A deflectable polymeric diaphragm is coupled to the interface portion of the polymeric flange. An instrument coupling portion is sealingly coupled to the polymeric flange. The instrument coupling portion is configured to couple to the re-usable sensing instrument. Another single-use sensor interface for coupling a single-use container to a re-usable sensing instrument includes a polymeric hose adapter and at least one instrument attachment portion. The polymeric hose adapter portion has at least one hose barb configured to retain a hose slid thereover. The hose adapter portion has at least one interface portion that is configured to receive a deflectable polymeric diaphragm.

Abstract: An inline particle sensor includes a sensor head configured to mount within a fitting, the sensor head including a laser source sealed and isolated from a sensing volume and configured to emit a laser beam through the sensing volume and a detector arranged to detect particles in the sensing volume that pass through the laser beam. The vacuum particle sensor further includes electronics coupled to the sensor head and configured to receive a signal indicative of the particles from the detector and provide a particle output based on the signal.

Abstract: A computer-implemented method of and system for measuring a three-dimensional surface are provided. The method includes projecting structured illumination on the surface and acquiring a plurality of sets of images. The sets of images are processed to obtain a plurality of point clouds. A spatial accumulator is defined. A first point cloud of the plurality of point clouds is combined with a second point cloud of the plurality of point clouds into the spatial accumulator. Spatial coordinates of the surface are generated based on the contents of the spatial accumulator.

Abstract: A system for sensing a three-dimensional topology of a circuit board is provided. An illumination source generates patterned illumination from a first point of view. At least one camera acquires an image of the patterned illumination from a second point of view. A controller is coupled to the source, and to the at least one camera. The controller generates a height topology of the circuit board based on images acquired from first and second image detectors of the patterned illumination. The characteristics of the pattern illumination are modified based on knowledge of the circuit board to enhance the dynamic range of the sensor and to reject image defects caused by multipath reflections.

Abstract: A method of calibrating a three-dimensional measurement system having a plurality of cameras and at least one projector is provided. The method includes performing a full calibration for each camera/projector pair where the full calibration generates at least two sets of correction matrices. Subsequently, an updated calibration is performed for each camera/projector pair. The updated calibration changes less than all of the sets of correction matrices.

Abstract: An illuminator is described which may be used with large inspection areas and which provides a dark field illumination pattern that is spatially uniform, illuminates from consistent angles, has high efficiency, and is smaller than existing solutions. A light pipe has a first end proximate an object to be illuminated and a second end opposite the first end and spaced from the first end. The light pipe also has at least one reflective sidewall. The first end of the light pipe includes an exit aperture and the second end has at least one opening to allow at least one image acquisition device to view the surface therethrough. At least one light source is configured to provide illumination in the light pipe. The object is illuminated by the first end of the light pipe by illumination at a selected elevation angle and substantially all azimuth angles.

Abstract: A system for sensing a three-dimensional topology of a circuit board is provided. An illumination source generates patterned illumination from a first point of view. At least one camera acquires an image of the patterned illumination from a second point of view. A controller is coupled to the source, and to the at least one camera. The controller generates a height topology of the circuit board based on images acquired from first and second image detectors of the patterned illumination. The characteristics of the pattern illumination are modified based on knowledge of the circuit board to enhance the dynamic range of the sensor and to reject image defects caused by multipath reflections.

Abstract: An electronics assembly line includes a first electronics assembly machine and a second electronics assembly machine. The first electronics assembly machine has a first electronics assembly machine outlet. The second electronics assembly machine has a second electronics assembly machine inlet and outlet. The inlet of the second electronics assembly machine is coupled to the outlet of the first electronics assembly machine by a conveyor. A first optical inspection sensor is disposed over the conveyor before the inlet of the second electronics assembly and is configured to provide first sensor inspection image data relative to a substrate that passes beneath the first optical inspection sensor in a non-stop fashion. A second optical inspection sensor is disposed over the conveyor after the outlet of the second electronics assembly machine and is configured to provide second sensor inspection image data relative to a substrate that passes beneath the second optical inspection sensor in a non-stop fashion.

Abstract: A substrate-like particle sensor includes a substrate-like base portion and an electronics enclosure disposed on the substrate-like base portion. A power source is located within the electronics enclosure. A controller is operably coupled to the power source. A particle sensor is operably coupled to the controller and provides an indication to the controller of at least one particle present near the particle sensor.

Abstract: A system for measuring solder paste stencil aperture positions and sizes is provided. The system includes at least one camera configured to acquire images of the stencil and an alignment target. A motion system generates relative motion between the at least one camera and the stencil. A controller is coupled to and controls the motion system. The controller is configured to analyze the images to generate aperture information relative to the stencil. The aperture information is provided to automatically program a solder paste inspection system. Other features and benefits that characterize embodiments of the present invention will be apparent upon reading the following detailed description and review of the associated drawings.

Abstract: A system for sensing a three-dimensional topology of a circuit board is provided. An illumination source projects an illumination pattern from a first angle of incidence. A first camera acquires an image of the structured light pattern on the circuit board from a second angle of incidence. A second camera simultaneously acquires an image of the structured light pattern on the circuit board from a third angle of incidence, the third angle of incidence differing from the second angle of incidence. A controller is coupled to the illumination source and to the at least two camera devices. The controller generates a height topology of the circuit board based on images acquired from the at least two camera devices of the structure light illuminator.

Abstract: An optical inspection system for inspecting a substrate is provided. The system includes an array of cameras configured to acquire a plurality of sets of images as the substrate and the array undergo relative motion with respect to each other. At least one focus actuator is operably coupled to each camera of the array of cameras to cause displacement of at least a portion of each camera that affects focus. A substrate range calculator is configured to receive at least portions of images from the array and to calculate range between the array of cameras and the substrate. A controller is coupled to the array of cameras and to the range calculator. The controller is configured to provide a control signal to each of the at least one focus actuator to adaptively focus each camera of the array during the relative motion.