Abstract: A sputtering device includes at least: a vacuum container defining a vacuum space; a substrate holder installed rotatably in the vacuum space; a substrate installed on the substrate holder; a target for forming thin film on the substrate; and a rotatable sputtering cathode in which the target is installed. The sputtering cathode is slanted relative to the substrate, and a center of the target is eccentric to a rotation axis of the sputtering cathode.

Abstract: A vacuum chamber assembly comprises a floor plate, an upper plate, plural props standing on the floor plate to support the upper plate, and side plates closing side opening portions between the props. First connected portions between the floor plate and the props and second connected portions between the upper plate and the props are fixed by screws. Circumferential edge portions of the side opening portions are provided with installation grooves, respectively. A gasket includes side surface sealing portions installed in the installation grooves formed on the circumferential edge portions of the side opening portions, respectively, and connection sealing portions for sealing the first connected portions and the second connected portions. The side plates are fixed to the circumferential edge portions to close the side opening portions via the side surface sealing portions of the gasket, respectively.

Abstract: An object of the invention is to provide a sputtering device which can provide increased distribution of film formation and coverage distribution better than prior sputtering devices. Thus, this invention is that, in the sputtering device constituted of a substrate holder for holding a substrate, at least one target for forming a thin film on the substrate, at least one sputtering cathode which has the target and magnets arranged behind the substrate, an axis of the target is inclined to an axis of the sputtering cathode, and the sputtering cathode is rotated on its axis to make the target swing relative to the substrate.