Abstract: A pallet for holding a printed circuit board on a conveyor in a solder wave machine which applies molten solder to the underside of the printed circuit board for completing connections, includes a pair of longitudinally extending first and second bars mounted on a frame, the bars including a pair of oppositely disposed longitudinally-extending grooves for receiving the opposite side marginal edges of the printed circuit board. Each one of the grooves is substantially channel-shaped and extends to the rear end portion of the bars so that the printed circuit board may be slipped into the grooves at the rear end portion of the bars to insert the board in position. One of the bars is transversely movable relative to the frame, and the other bar is fixed in position on the frame, the movable bar being fixed releasably to the first bar in an adjusted position to the frame for accommodating various different sizes of boards.