Patents Assigned to D3 Global, Inc.
  • Patent number: 12764091
    Abstract: A method includes a processor receiving a request having an expression of interest from a computing device associated with a user. The expression of interest is for an intent to register a future domain name in a DNS. The future domain name is a domain name in a TLD that is not currently registered by a TLD registry. The processor determines an availability of the future domain name by querying on-chain databases and off-chain databases for occurrences of the future domain name. When the future domain name is available, the processor allocates usage rights to the expression of interest. The usage rights are associated with an account of the user. The processor generates a digital token for the expression of interest representing usage rights of the intent to register the future domain name in a future TLD registry. The processor records the digital token on a blockchain.
    Type: Grant
    Filed: April 30, 2024
    Date of Patent: October 13, 2026
    Assignee: D3 Global, Inc.
    Inventor: Frederick Weider Hsu
  • Publication number: 20240372827
    Abstract: A method includes a processor receiving a request having an expression of interest from a computing device associated with a user. The expression of interest is for an intent to register a future domain name in a DNS. The future domain name is a domain name in a TLD that is not currently registered by a TLD registry. The processor determines an availability of the future domain name by querying on-chain databases and off-chain databases for occurrences of the future domain name. When the future domain name is available, the processor allocates usage rights to the expression of interest. The usage rights are associated with an account of the user. The processor generates a digital token for the expression of interest representing usage rights of the intent to register the future domain name in a future TLD registry. The processor records the digital token on a blockchain.
    Type: Application
    Filed: April 30, 2024
    Publication date: November 7, 2024
    Applicant: D3 Global, Inc.
    Inventor: Frederick Weider Hsu