Patents Assigned to Dae Eun Electronics Co., Ltd.
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Patent number: 7052307Abstract: The present invention discloses a modular jack for connecting a modular plug, and more particularly, a modular jack with a connection cap which comprises: a plurality of IDC terminals electrically connected to a printed circuit board; a back cover provided with a plurality of penetration grooves so as to support the IDC terminals; and a connection cap for pressurizing and connecting wires to connection slits of the IDC terminals penetrated through penetration grooves of the back covers and protruded outward, the connection cap being provided with terminal insertion grooves for inserting the plurality of IDC terminals and a plurality of wire insertion grooves for coupling wires, the back cover and the connection cap being detachably coupled to a housing.Type: GrantFiled: February 3, 2004Date of Patent: May 30, 2006Assignee: Dae Eun Electronics Co., Ltd.Inventors: Jung Gon Kim, Jung Suk Lee, Hye Jung Kim
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Publication number: 20050170682Abstract: The present invention discloses a modular jack for connecting a modular plug, and more particularly, a modular jack with a connection cap which comprises: a plurality of IDC terminals electrically connected to a printed circuit board; a back cover provided with a plurality of penetration grooves so as to support the IDC terminals; and a connection cap for pressurizing and connecting wires to connection slits of the IDC terminals penetrated through penetration grooves of the back covers and protruded outward, the connection cap being provided with terminal insertion grooves for inserting the plurality of IDC terminals and a plurality of wire insertion grooves for coupling wires, the back cover and the connection cap being detachably coupled to a housing.Type: ApplicationFiled: February 3, 2004Publication date: August 4, 2005Applicant: Dae Eun Electronics Co., Ltd.Inventors: Jung Kim, Jung Lee, Hye Kim
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Patent number: 6764348Abstract: Disclosed relates a modular jack that can be manufactured simply with small size and reduce cross talk induced from the plug satisfactorily. The modular jack includes a housing for receiving a plug and an insert for electrically connecting to the plug. The insert includes first and second conductors of first to fourth signal pairs, the first and second conductors of the first, second and fourth signal pair [T1, R1], [T2 and R2] and [T4 and R4], adjacent to the first and second conductors of the third signal pair [T3 and R3], are intersected with each other in a multi-layered wiring structure to generate inductive cross talk having a reverse phase against cross talk that arises from the plug, thus canceling the cross talk.Type: GrantFiled: March 13, 2003Date of Patent: July 20, 2004Assignee: Dae Eun Electronics Co., Ltd.Inventors: Chang Roul Han, Sang Hyouk Lee
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Publication number: 20040102099Abstract: Disclosed relates a modular jack that can be manufactured simply with small size and reduce cross talk induced from the plug satisfactorily. The modular jack includes a housing for receiving a plug and an insert for electrically connecting to the plug. The insert includes first and second conductors of first to fourth signal pairs, the first and second conductors of the first, second and fourth signal pair [T1, R1], [T2 and R2] and [T4 and R4], adjacent to the first and second conductors of the third signal pair [T3 and R3], are intersected with each other in a multi-layered wiring structure to generate inductive cross talk having a reverse phase against cross talk that arises from the plug, thus canceling the cross talk.Type: ApplicationFiled: March 13, 2003Publication date: May 27, 2004Applicant: Dae Eun Electronics Co., Ltd.Inventors: Chang Roul Han, Sang Hyouk Lee