Patents Assigned to Daetec, LLC
  • Etch chemistries for metallization in electronic devices
    Patent number: 10923514
    Abstract: In various embodiments, etchants featuring (i) mixtures of hydrochloric acid, methanesulfonic acid, and nitric acid, or (ii) mixtures of phosphoric acid, methanesulfonic acid, and nitric acid, are utilized to etch metallic bilayers while minimizing resulting etch discontinuities between the layers of the bilayer.
    Type: Grant
    Filed: December 12, 2018
    Date of Patent: February 16, 2021
    Assignees: H.C. STARCK INC., DAETEC. LLC
    Inventors: Patrick Hogan, John Moore, Alex Brewer, Jared Pettit
  • Etch chemistries for metallization in electronic devices
    Patent number: 10186530
    Abstract: In various embodiments, etchants featuring (i) mixtures of hydrochloric acid, methanesulfonic acid, and nitric acid, or (ii) mixtures of phosphoric acid, methanesulfonic acid, and nitric acid, are utilized to etch metallic bilayers while minimizing resulting etch discontinuities between the layers of the bilayer.
    Type: Grant
    Filed: August 29, 2016
    Date of Patent: January 22, 2019
    Assignees: H.C. STARCK INC., DAETEC, LLC
    Inventors: Patrick Hogan, John Moore, Alex Brewer, Jared Pettit
  • Etch chemistries for metallization in electronic devices
    Patent number: 9455283
    Abstract: In various embodiments, etchants featuring (i) mixtures of hydrochloric acid, methanesulfonic acid, and nitric acid, or (ii) mixtures of phosphoric acid, methanesulfonic acid, and nitric acid, are utilized to etch metallic bilayers while minimizing resulting etch discontinuities between the layers of the bilayer.
    Type: Grant
    Filed: March 3, 2015
    Date of Patent: September 27, 2016
    Assignees: H.C. Starck, Inc., Daetec, LLC
    Inventors: Patrick Hogan, John Moore, Alex Brewer, Jared Pettit