Abstract: Introduced here are carrier tape assemblies that can improve efficiency and reduce costs when utilized in the handling, transport, or storage of semiconductor components. A carrier tape assembly can include an adhesive film affixed to an elongated and/or extruded carrier tape. For example, the adhesive film may be integrally laminated onto the top surface of the elongate carrier tape as a single continuous (i.e., unbroken) sheet. The adhesive film may substantially conform to the top surface of the elongate carrier tape, including any punched cavities for holding semiconductor components. Proper securement of the semiconductor components to the carrier tape assembly depends on the adhesive property of the constituent material(s) of the adhesive film.
Type:
Grant
Filed:
June 13, 2022
Date of Patent:
September 19, 2023
Assignee:
Daewon Semiconductor Packaging Industrial Company
Inventors:
Sunna Chung, John Kim, Ryan Park, Denny Kwon, Matthew Whitlock, Athens Okoren
Abstract: Introduced here are carrier tape assemblies that can improve efficiency and reduce costs when utilized in the handling, transport, or storage of semiconductor components. A carrier tape assembly can include an adhesive film affixed to an elongated and/or extruded carrier tape. For example, the adhesive film may be integrally laminated onto the top surface of the elongate carrier tape as a single continuous (i.e., unbroken) sheet. The adhesive film may substantially conform to the top surface of the elongate carrier tape, including any punched cavities for holding semiconductor components. Proper securement of the semiconductor components to the carrier tape assembly depends on the adhesive property of the constituent material(s) of the adhesive film.
Type:
Grant
Filed:
August 29, 2018
Date of Patent:
June 14, 2022
Assignee:
Daewon Semiconductor Packaging Industrial Company
Inventors:
Sunna Chung, John Kim, Ryan Park, Denny Kwon, Matthew Whitlock, Athens Okoren
Abstract: Introduced here is a wafer separator configured to carry a semiconductor wafer with improved efficiency, protection, and reduced costs when utilized in the handling, transport, or storage of semiconductor components. The wafer separator may include a circular ring having an outer edge defining a periphery of the circular ring. The circular ring may include an inner edge defining a central opening of the circular ring. The wafer separator may include a first-right angled recess for receiving a semiconductor wafer that extends downward from a top surface of the circular ring. The wafer separator may also include a second right-angled recess for maintaining a gap beneath the semiconductor wafer when the semiconductor wafer is set within the first right-angled recess. In some embodiments, the wafer separator also includes interlock components for connecting the wafer separator to adjacent wafer separators.
Type:
Grant
Filed:
August 29, 2018
Date of Patent:
February 22, 2022
Assignee:
Daewon Semiconductor Packaging Industrial Company
Inventors:
Sunna Chung, Ryan Park, Jin Chae, Matthew Whitlock, Jonathan Lie, Athens Okoren