Abstract: Provided is a semiconductor pressure sensor which includes: five connection pads having plate shapes and formed of conductive materials, respectively, and arranged in parallel with each other; and four semiconductor resistance units connecting a predetermined pair of the connection pads to each other among the connection pads and having resistance values varying in proportion to a variation of a length due to the external pressure, wherein the five connection pads include a power supply pad, a first output voltage pad, a first ground pad, a second output voltage pad, and a second ground pad.