Patents Assigned to Dage Precision Industries, Ltd.
  • High speed pull test device and method
    Patent number: 8015883
    Abstract: A device and method for tensile testing of the bond strength of an electrically conductive ball adhered to a substrate. A ball is gripped and moved at a speed in a direction substantially orthogonal to the plane of adherence. The substrate is abruptly halted by an abutment to impose a sudden load on the ball/substrate interface. During the test the substrate is lightly urged toward the ball to eliminate unwanted tensile forces.
    Type: Grant
    Filed: December 7, 2010
    Date of Patent: September 13, 2011
    Assignee: Dage Precision Industries Ltd.
    Inventors: Benjamin Kingsley Stuart Peecock, Robert John Sykes, Alan Norman Wiltshire
  • HIGH SPEED PULL TEST DEVICE AND METHOD
    Publication number: 20110079088
    Abstract: A device and method for tensile testing of the bond strength of an electrically conductive ball adhered to a substrate. A ball is gripped and moved at a speed in a direction substantially orthogonal to the plane of adherence. The substrate is abruptly halted by an abutment to impose a sudden load on the ball/substrate interface.
    Type: Application
    Filed: December 7, 2010
    Publication date: April 7, 2011
    Applicant: DAGE PRECISION INDUSTRIES LTD.
    Inventors: Benjamin Kingsley Stuart Peecock, Robert John Sykes, Alan Norman Wiltshire
  • Test Apparatus
    Publication number: 20080190212
    Abstract: A device (10) for shear testing of very small protrusions of an electrical semi-conductor device includes a sensor (30) for detecting surface contact of a shear test tool (15). The lateral shear force transducer is also used to detect scrubbing forces as the tool is reciprocated on the substrate, so as to give accurate surface contact sensing of non-rigid substrates. After contact sensing, the test tool is stepped back to ensure the shear test is performed without dragging of the tool on the substrate.
    Type: Application
    Filed: May 5, 2005
    Publication date: August 14, 2008
    Applicant: DAGE PRECISION INDUSTRIES LTD.
    Inventor: Robert John Sykes
  • Apparatus and method for testing strength of electrical bond sites on semiconductor devices
    Patent number: 6237422
    Abstract: A test device for applying a tensile force to electrical bond sites of a semiconductor device includes jaws (21), adapted to closely engage the surface of the bond site, typically a solder ball (22), while an inner edge portion (23) of each jaw approaches the jaw axis. By closely confining the bond site, the clamping forces exerted can be increased without risk that the bond site will be crushed. In a preferred embodiment the jaws permit slight reshaping of the bond site to increase the area of engagement therewith.
    Type: Grant
    Filed: December 9, 1998
    Date of Patent: May 29, 2001
    Assignee: Dage Precision Industries Ltd.
    Inventor: Robert Sykes
  • Apparatus and method for testing bond strength of electrical connection
    Patent number: 6178823
    Abstract: An apparatus and method for testing angled strand connections in a miniature electrical device includes a test tool movable simultaneously along two mutually perpendicular axes and perpendicular to the strand direction. The tool measures breaking force along one axis only, the breaking force in the direction of tool movement being calculated by reference to the angle of tool movement. The method gives rapid testing of successive strands with good operator view.
    Type: Grant
    Filed: May 28, 1999
    Date of Patent: January 30, 2001
    Assignee: Dage Precision Industries, Ltd.
    Inventor: Robert Sykes
  • Test apparatus
    Patent number: 6078387
    Abstract: Apparatus for testing electrical bonds of a semiconductor device includes a cantilever arm (14a) with a test head (16) mounted thereon. The test head (16) is biased by the arm (14a) against a base plate (11), but can be moved away from the base plate (11) by an air bearing (22) to ensure substantially frictionless initial positioning. Sensing means (32;34) for sensing contact with a semiconductor substrate are also disclosed.
    Type: Grant
    Filed: November 20, 1998
    Date of Patent: June 20, 2000
    Assignee: Dage Precision Industries, Ltd.
    Inventor: Robert Sykes