Patents Assigned to Dai-ichi High Frequency Company Limited
  • Resin-bonding method
    Patent number: 5123989
    Abstract: Disclosed herein is a method for bonding a resin part, which comprises disposing a magnetic complex composed of a resin and magnetic particles as a heating-medium at the resin parts to be bonded, and applying an alternating magnetic field to the heating-medium by using a magnetic field generating means composed of an electromagnetic core and an exciting coil, thereby making said heating-medium generate heat for fuse-bonding said resins.
    Type: Grant
    Filed: June 11, 1990
    Date of Patent: June 23, 1992
    Assignees: Toda Kogyo Corporation, Dai-ichi High Frequency Company Limited
    Inventors: Nanao Horiishi, Kotaro Hirayama, Masanori Terasaki, Tetsuro Toda, Shigeru Takaragi