Patents Assigned to Dai-Ichi Seiko Co., Ltd.
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Publication number: 20120289085Abstract: Occurrence of defective electrical connection caused by dust that has entered the interior through a corresponding insertion hole can be prevented well by a simple configuration. A through hole facing a corresponding insertion hole is formed to penetrate through a movable contact attached to an insulating housing, and two corresponding connector contact pieces are disposed respectively in both sides sandwiching the through hole. Thus, the dust that has entered the interior through the corresponding insertion hole opened when a corresponding connector is not mated is configured to be discharged through the through hole without accumulating the dust on the movable contact to reduce the risk that the electrical conductivity between the movable contact and the fixed contact may be disturbed by the dust.Type: ApplicationFiled: April 25, 2012Publication date: November 15, 2012Applicant: DAI-ICHI SEIKO CO., LTD.Inventors: Takeshi HIRAKAWA, Kenichi Yotsutani
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Publication number: 20120289084Abstract: Instability of an electric connection state due to solder-wicking from a board connecting part of an electrically-conductive shell can be prevented with a simple configuration. A recessed part recessed toward a fixed contact and a movable contact is provided in the board connecting part of the electrically-conductive shell attached to an insulating housing. An excessive amount of a solder material or flux that is used at the board connecting part of the electrically-conductive shell and tries to rise along the wall surfaces of the board connecting part or the electrically-conductive shell is stored in the recessed part. The acting force of the rise is reduced by a reverse-tapered inclined surface constituting a wall surface of the recessed part. Furthermore, the length of the rise of the solder material and flux is extended by a curved wall surface of the recessed part. Thus, so-called solder-wicking is configured to be prevented well.Type: ApplicationFiled: April 25, 2012Publication date: November 15, 2012Applicant: DAI-ICHI SEIKO CO., LTD.Inventor: Takeshi HIRAKAWA
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Publication number: 20120276788Abstract: A mating operation mutually between connectors can be easily and precisely carried out with a simple configuration. An insertion reference surface having a predetermined outer-diameter size D1 is provided to extend by a predetermined length in an axial direction on an outer peripheral surface of an inner-side contact among both cylindrical-shaped contacts overlapped with each other in inside/outside in the radial direction. A mutual mating relation is set so that the inner peripheral surface of the outer-side contact has an inner-diameter size D2 (D2?D1) approximately same as an outer-diameter size D1 of the insertion reference surface of the inner-side contact. The outer-side contact can be smoothly inserted while carrying out positioning by the insertion reference surface of the inner-side contact 13.Type: ApplicationFiled: April 23, 2012Publication date: November 1, 2012Applicant: Dai-Ichi Seiko Co., Ltd.Inventors: Tomohito TAKANO, Hidenori Minegishi
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Publication number: 20120238125Abstract: To allow a quick and reliable check with a simple structure as to whether a signal transmission medium has been inserted up to a predetermined position or whether a lock operation has been completed, an insulating housing is provided with lock checking device allowing a displaced state or an engaged state of a lock member to be visually checked. With this, the displaced state of the lock member or a state in which the signal transmission medium has fallen in an engagement positioning part when the signal transmission medium is inserted up to the predetermined position can be visually checked through the lock checking device, thereby allowing the quality of an insertion state of the signal transmission medium to be immediately determined.Type: ApplicationFiled: March 9, 2012Publication date: September 20, 2012Applicant: DAI-ICHI SEIKO CO., LTD.Inventors: TAKASHI YOSHISUJI, YOSHINOBU SHIMADA
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Publication number: 20120225575Abstract: A configuration in which a stand-alone plug connector is directly fitted to the wall of a product case, and in the fitting state of the stand-alone plug connector, the contact part of a contact comes in contact with the contact part of a wiring pattern conductive path exposed on the surface of a fit connecting hole, and the electrical connection of a signal transmitting medium can be performed in a simple configuration.Type: ApplicationFiled: January 12, 2012Publication date: September 6, 2012Applicant: DAI-ICHI SEIKO CO., LTD.Inventors: Tetsuya TAGAWA, Takeshi Hirakawa
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Publication number: 20120220171Abstract: An electrical connector having a housing provided with an opening through which a flat circuit device is inserted into the housing, a plurality of conductive contacts arranged on the housing for contacting with connecting terminals on the flat circuit device in the housing, and a shell member mounted on the housing and provided therein with a holding portion for holding the flat circuit device in the housing and a manipulatable releasing portion for releasing the flat circuit device from holding by the holding portion, wherein the holding portion is constituted to extend from a portion of the shell member provided for covering one of opposite plate-shaped portions of the housing into an inside of the housing and to have an engaging projection formed thereon for selectively engaging with and disengaging from the flat circuit device.Type: ApplicationFiled: February 22, 2012Publication date: August 30, 2012Applicant: DAI-ICHI SEIKO CO., LTD.Inventors: Yoshinobu SHIMADA, Kosuke OZEKI
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Publication number: 20120208385Abstract: An electrical connector comprising a housing provided on one of opposite end portions thereof with an opening through which a flat circuit device is inserted into the housing, a plurality of conductive contacts arranged on the housing for contacting with connecting terminals on the flat circuit device in the housing, and a shell member mounted on the housing and provided therein with a holding portion operative to hold the flat circuit device in the housing. A releasing portion extends from the shell member toward the outside thereof, and a connecting portion extends from the releasing portion in a direction perpendicular to a conductive contact arrangement and the holding portion extends from the connecting portion, so that a folded-back protrusion is constituted in a body in the shell member with the releasing, connecting and holding portions.Type: ApplicationFiled: February 7, 2012Publication date: August 16, 2012Applicant: DAI-ICHI SEIKO CO., LTD.Inventor: Kosuke OZEKI
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Patent number: 8241065Abstract: An electrical connector comprising an end portion of a flat circuit device which forms a connectively engaging protrusion on which a plurality of contacting terminals are arranged and a supporting board portion for supporting the connectively engaging protrusion, and first and second conductive shells having respectively first and second plate portions opposite to each other with the supporting board portion between, wherein the first conductive shell is attached to the supporting board portion with the first plate portion thereof covering directly a first surface of the supporting board portion and the second conductive shell is attached also to the supporting board portion with the second plate portion thereof covering directly a second surface opposite to the first surface of the supporting board portion, so as to hold the connectively engaging protrusion supported with the supporting board portion for causing the same to engage with a mating electrical connector.Type: GrantFiled: March 1, 2011Date of Patent: August 14, 2012Assignee: Dai-Ichi Seiko Co., Ltd.Inventors: Hiroharu Ikari, Masao Ishimaru
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Patent number: 8235739Abstract: An electrical connector comprising a housing provided with an opening through which an FPC is inserted into the housing, a plurality of conductive contacts arranged on the housing for coming into contact with signal connecting terminals on the FPC inserted in the housing, and a conductive shell mounted on the housing and provided therein with a holding member operative to hold the FPC inserted in the housing and a releasing member extending from the holding member to be operative to release the FPC from holding by the holding member, wherein the holding member includes an engaging projection for engaging with an engaging edged portion provided on the FPC inserted in the housing and the releasing member includes a handle portion positioned on the outside of the housing to be handled for causing the engaging projection of the holding member to disengage from the engaging edged portion on the FPC inserted in the housing.Type: GrantFiled: August 17, 2010Date of Patent: August 7, 2012Assignee: Dai-Ichi Seiko Co., Ltd.Inventor: Yoshimitsu Hashimoto
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Publication number: 20120171890Abstract: It is made possible to maintain a fitted state with a mating connector excellently by a fit-turning arm. A cam portion is provided at a turning shaft portion of a fit-turning arm which holds a fitted state of a connector with a mating connector, a cam-biasing device is provided on a connector main body, and the fit-turning arm is made hard to depart from a “fit-acting position” by applying a turning biasing force to the cam portion 13d in a direction of holding the fit-turning arm which has been turned to the “fit-acting position” at the “fit-acting position”, so that a fitted state of both the connectors are maintained excellently.Type: ApplicationFiled: August 1, 2011Publication date: July 5, 2012Applicant: DAI-ICHI SEIKO CO., LTD.Inventor: Takaki Kurachi
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Patent number: 8172610Abstract: To make it possible to improve the grounding property of a conductive shell with a simple configuration. Connector-side ground connecting members (ground spring pieces) 24c provided in a conductive ground shell 24 of a receptacle connector 2 and board-side ground connecting members (rear holddowns) 24b are disposed such that they extend approximately in parallel with a fitting direction of a plug connector 1 serving as a fitting mate for the receptacle connector 2, and ground currents flowing between the connector-side ground connecting members 24c and the board-side ground connecting members 24b take the shortest straight courses so that occurrence of electrical loss or an undesired inducing phenomenon is substantially suppressed.Type: GrantFiled: September 23, 2010Date of Patent: May 8, 2012Assignee: Dai-Ichi Seiko Co., Ltd.Inventor: Takaki Kurachi
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Patent number: 8029720Abstract: A resin molten in a pot portion 59 is molded by being loaded via a gate 48 into a cavity, which has a rectangular parallelepiped shape in plan view and is formed of both molds 1 and 2, which are a second mold 2 and a first mold 1 that can make or release contact with the second mold 2. The pot portion 59 is provided at either one of the molds 1 and 2 and constituted of recess portions 54c located at prescribed intervals at the cavity. The recess portions 54c have a bottom surface constituted of part of a moving member 60 movable toward an opening portion. The gate 48 is structured so that one side of the cavity and the long side of the pot portion 59 are connected with each other.Type: GrantFiled: November 17, 2006Date of Patent: October 4, 2011Assignee: Dai-Ichi Seiko Co., Ltd.Inventors: Kenji Ogata, Yoshihiro Mitsui
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Patent number: 7887313Abstract: To provide a mold apparatus for resin encapsulation, which is small in number of components, has a simple driving mechanism, is easy in assembly or disassembly work, requires no labor for maintenance and has good workability; and a resin encapsulation method. Therefore, of a lower cavity bar 51 and an upper cavity bar 26, a plurality of groove-shaped pots 52 are provided in parallel at a predetermined pitch in a region where a substrate board is disposed, and each groove-shaped pot 52 is individually provided with a plurality of cavities 54 in parallel through runners. Then, a plunger plate 60 inserted in the grooved-shaped pot 52 in a manner so as to be able to move up and down is driven by a plunger 76, whereby a resin for encapsulation inserted into the pot 52 is melted with the plunger plate 60, and the melted resin is filled in the cavities 54 through the runners.Type: GrantFiled: November 24, 2006Date of Patent: February 15, 2011Assignee: Dai-Ichi Seiko Co., Ltd.Inventors: Kenji Ogata, Masashi Nishiguchi, Kenichiro Imamura
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Patent number: 7413425Abstract: A resin sealing mold for semiconductor devices, which is designed to thoroughly accommodate board thickness variations and prevent formation of burrs and which is easy to maintain. To this end, a plurality of pistons (42) supporting, at one of their respective ends, lower mold cavities (56) have the other ends thereof slidably inserted in hydraulic cylinder blocks installed on lower mold sets (40).Type: GrantFiled: September 14, 2005Date of Patent: August 19, 2008Assignee: Dai-Ichi Seiko Co., Ltd.Inventors: Kenji Ogata, Masashi Nishiguchi, Yoshihiro Mitsui
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Patent number: 7008575Abstract: A resin sealing mold for semiconductor devices, which is designed to thoroughly accommodate board thickness variations and prevent formation of burrs and which is easy to maintain. To this end, a plurality of pistons (42) supporting, at one of their respective ends, lower mold cavities (56) have the other ends thereof slidably inserted in hydraulic cylinder blocks installed on lower mold sets (40).Type: GrantFiled: December 14, 2000Date of Patent: March 7, 2006Assignee: Dai-Ichi Seiko Co., Ltd.Inventors: Kenji Ogata, Masashi Nishiguchi, Yoshihiro Mitsui
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Patent number: 5750423Abstract: A leadframes is provided with at least one supporting portion extending from an island thereof in the direction opposite to a surface on which a semiconductor chip is mounted, so that the supporting portion comes into contact with a bottom surface of a cavity of a mold for encapsulation of semiconductor chips with a resin when said mold is closed.Type: GrantFiled: August 25, 1995Date of Patent: May 12, 1998Assignee: Dai-Ichi Seiko Co., Ltd.Inventor: Masaaki Ishii
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Patent number: 5626886Abstract: A transfer molding machine for encapsulation of semiconductor devices with a resin comprises a clamping mechanism with an electrically actuated toggle mechanism, a pair of upper and lower sections of a transfer mold, and at least one compensation unit including upper and lower plates and a plurality of elastic members held between said upper and lower plates. The compensation unit is arranged either between the upper stationary platen and the upper mold section or between the moving platen and the lower mold section to compensate the dimensional errors in the mold sections and clamping mechanism.Type: GrantFiled: February 21, 1995Date of Patent: May 6, 1997Assignee: Dai-Ichi Seiko Co., Ltd.Inventor: Masaaki Ishii
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Patent number: 5420771Abstract: A thin illumination device providing uniform luminance distribution on the diffusing plate comprising a reflecting plate, linear light sources arranged in the vicinity of the reflecting plate and a diffusing plate arranged on the opposite side of the reflecting plate with regard to the light sources, section of the reflecting plate having a shape of continuous curves having different curvature.Type: GrantFiled: January 29, 1993Date of Patent: May 30, 1995Assignee: Dai-Ichi Seiko Co., Ltd.Inventors: Hideaki Katoh, Nobuhisa Noguchi, Teruo Hoshi
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Patent number: 5204122Abstract: A mold system for use in resin encapsulation molding includes a cavity serving as a resin molding section in which small size electric elements such as semiconductor devices and electrical parts are encapsulated with a synthetic resin. The system also incudes at least one pot for receiving the synthetic resin material and melting the received synthetic resin material by heating, a cull section communicating with the pot and formed facing to an opening end face, and a conveying passage for communicating the cull section and the cavity to convey molten resin material through the cull section. The synthetic resin material is placed in the cavity and is heated to melt therein, and is extruded out of the pot by a plunger disposed in an axial direction of the pot. The inner bottom of the cull section facing to the opening end face of the pot is formed unevenly.Type: GrantFiled: January 23, 1992Date of Patent: April 20, 1993Assignee: Dai-Ichi Seiko Co., Ltd.Inventor: Akira Konishi
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Patent number: 5186537Abstract: A thin illumination device providing uniform luminance distribution on the diffusing plate comprising a reflecting plate, linear light sources arranged in the vicinity of the reflecting plate and a diffusing plate arranged on the opposite side of the reflecting plate with regard to the light sources, section of the reflecting plate having a shape of continuous curves having different curvature.Type: GrantFiled: June 3, 1991Date of Patent: February 16, 1993Assignee: Dai-Ichi Seiko Co., Ltd.Inventors: Hideaki Katoh, Nobuhisa Noguchi, Yutaka Kikuchi, Isamu Kaneko, Teruo Hoshi