Patents Assigned to Dai Nippon Painting Co., Ltd.
  • Electronic part taping packaging cover tape
    Publication number: 20060199005
    Abstract: The present invention relates to a cover tape for tape packaging electronic components that heat-seals a carrier tape accommodating therein electronic components. A cover tape for tape packaging electronic components according to the present invention includes a substrate film layer, a soft material layer, and a thermal adhesive layer. The soft material layer is formed of metallocene linear low-density polyethylene having a specific gravity in a range of from 0.888 to 0.907.
    Type: Application
    Filed: April 26, 2004
    Publication date: September 7, 2006
    Applicant: Dai Nippon Painting Co., Ltd.
    Inventors: Kazuhito Fuji, Shinnichi Katou