Patents Assigned to DAICEL CORPORATION
  • Publication number: 20240067777
    Abstract: The present invention provides a curable compound product that forms a cured product having excellent heat resistance and high insulating properties by performing heat treatment. The curable compound product of the present disclosure contains a compound represented by Formula (1) below, and a proportion of a group represented by Formula (r-1) below to the sum of the group represented by Formula (r-1) below and a group represented by Formula (r-2) below is 97% or greater. In Formula (1), R1 and R2 are identical or different, and each represent the group represented by Formula (r-1) the group represented by Formula (r-2) below: D1 and D2 are identical or different, and each represent a single bond or a linking group. L represents a divalent group having a repeating unit containing a structure represented by Formula (I) below and a structure represented by Formula (II) below.
    Type: Application
    Filed: December 25, 2020
    Publication date: February 29, 2024
    Applicant: DAICEL CORPORATION
    Inventors: Feng LIU, Yoshimichi OKANO, Kouji NAKATANI
  • Publication number: 20240069255
    Abstract: A technique with which a more uniform irradiance distribution can be more reliably obtained than before is provided. A micro lens array includes: a plurality of lens elements arrayed on at least one surface of a planar member. A shape of a lens surface in each of the lens elements is defined by an aspherical expression. A pitch D between the lens elements in the micro lens array is 25 ?m or greater and 150 ?m or less. An intensity distribution of light that passes through the micro lens array has a batwing intensity distribution in which light intensity at both ends in a predetermined range of an angle of view is maximized and light intensity at the center in the range of the angle of view is minimized.
    Type: Application
    Filed: December 20, 2021
    Publication date: February 29, 2024
    Applicant: Daicel Corporation
    Inventors: Makoto Yasuhara, Maki Kishimoto
  • Publication number: 20240071701
    Abstract: An electric circuit breaker device includes: an igniter provided to a housing; a projectile disposed in an accommodating space, the accommodating space being formed in the housing and extending in one direction, the projectile being to be projected along the accommodating space by energy received from the igniter; a conductor piece that is provided to the housing, forms a portion of an electric circuit, includes in a portion thereof a cutoff portion to be cut off by the projectile that moves by the energy received from the igniter, and is disposed with the cutoff portion crossing the accommodating space; a coolant material disposed in an arc-extinguishing region, the arc-extinguishing region being positioned within the accommodating space, on a side opposite to the projectile prior to actuation of the igniter with the cutoff portion interposed between the arc-extinguishing region and the projectile, and configured to receive the cutoff portion cut off by the projectile; and a modified resin material that is d
    Type: Application
    Filed: January 7, 2022
    Publication date: February 29, 2024
    Applicant: DAICEL CORPORATION
    Inventors: Tomohide FUJIWARA, Katsuya TONE
  • Patent number: 11915925
    Abstract: An object of the present invention is to provide a technique suitable for achieving low wiring resistance and reducing a variation in the resistance value between semiconductor elements to be multilayered in a method of manufacturing a semiconductor device in which the semiconductor elements are multilayered through laminating semiconductor wafers via an adhesive layer. The method of the present invention includes first to third processes. In the first process, a wafer laminate Y is prepared, the wafer laminate Y having a laminated structure including a wafer 3, wafers 1T with a thickness from 1 to 20 um, and an adhesive layer 4 with a thickness from 0.5 to 4.5 ?m interposed between a main surface 3a of the wafer 3 and a back surface 1b of the wafer 1T. In the second process, holes extending from the main surface 1a of the wafer 1T and reaching a wiring pattern of the wafer 3 are formed by a predetermined etching treatment.
    Type: Grant
    Filed: October 18, 2019
    Date of Patent: February 27, 2024
    Assignee: DAICEL CORPORATION
    Inventor: Naoko Tsuji
  • Publication number: 20240058537
    Abstract: An injector configured to inject a solution containing a biomolecule and a gas that is predetermined into an injection target without using an injection needle, the injector including a storage portion configured to store the solution containing the biomolecule and the gas, a nozzle portion communicating with the storage portion, the nozzle portion including an ejection port configured to eject the solution containing the biomolecule and the gas toward the injection target, and a pressurization portion configured to pressurize the solution containing the biomolecule and the gas that are stored in the storage portion during an operation and to eject the solution containing the biomolecule and the gas from the ejection port toward the injection target.
    Type: Application
    Filed: December 28, 2021
    Publication date: February 22, 2024
    Applicant: DAICEL CORPORATION
    Inventors: Yuko SAKAGUCHI, Kazuhiro TERAI
  • Publication number: 20240062977
    Abstract: An electric circuit breaker device includes: an igniter provided to a housing; a projectile disposed in an accommodating space formed in the housing, the projectile being to be projected along the accommodating space by energy received from the igniter; a conductor piece that is provided to the housing, forms a portion of an electric circuit, includes in a portion thereof a cutoff portion to be cut off by the projectile, and is disposed with the cutoff portion crossing the accommodating space; an arc-extinguishing region positioned on a side opposite to the projectile prior to actuation of the igniter with the cutoff portion interposed between the arc-extinguishing region and the projectile, and configured to receive the cutoff portion cut off by the projectile; a first coolant material disposed in the arc-extinguishing region; and a second coolant material disposed between the projectile and the cutoff portion in the accommodating space prior to actuation of the igniter.
    Type: Application
    Filed: December 27, 2021
    Publication date: February 22, 2024
    Applicant: DAICEL CORPORATION
    Inventor: Tomohide FUJIWARA
  • Publication number: 20240062976
    Abstract: An electric circuit breaker device includes: an igniter provided to a housing; a projectile disposed in an accommodating space formed in the housing, the projectile being to be projected along the accommodating space by energy received from the igniter; a conductor piece that is provided to the housing, forms a portion of an electric circuit, and includes in a portion thereof a cutoff portion disposed crossing the accommodating space and to be cut off by the projectile; and an arc-extinguishing region that is provided in the accommodating space and in which a coolant material is disposed, the arc-extinguishing region being configured to receive the cutoff portion after being cut off. The projectile includes a first projectile configured to cut off the cutoff portion from the conductor piece by being projected by the energy received from the igniter, and a second projectile configured to press, into the arc-extinguishing region, the cutoff portion cut off by the first projectile.
    Type: Application
    Filed: December 27, 2021
    Publication date: February 22, 2024
    Applicant: DAICEL CORPORATION
    Inventor: Tomohide FUJIWARA
  • Publication number: 20240059831
    Abstract: An object of the present disclosure is to provide a curable composition excellent in curability (especially high-speed curability) and capable of forming a cured product excellent in heat resistance (especially reflow heat resistance), and to provide a wafer-level lens formed by using the curable composition and a method for producing the wafer-level lens. A curable composition of the present disclosure includes the following components (A) and (B). component (A): a compound including an alicyclic epoxy group and including no ester bond, and component (B): a cationic polymerization initiator including a cation moiety and an anion moiety containing a gallium atom.
    Type: Application
    Filed: August 8, 2023
    Publication date: February 22, 2024
    Applicant: DAICEL CORPORATION
    Inventor: Hiroki TAKENAKA
  • Publication number: 20240060753
    Abstract: A gas generator includes a housing, an ignition device attached to one end side of the housing, a combustion chamber, a diffuser portion formed on the other end side and including a closed end, an open end, and a side wall positioned between the closed end and the open end, a plurality of gas discharge ports formed in the diffuser portion and including a first gas discharge port having a short distance from the combustion chamber and a second gas discharge port having a long distance from the combustion chamber, and a total opening area of the first gas discharge port and a total opening area of the second gas discharge port are different from each other, and a filter accommodated in the accommodating space, the filter extending from a side of the open end toward a side of the closed end in the diffuser portion.
    Type: Application
    Filed: October 30, 2023
    Publication date: February 22, 2024
    Applicant: Daicel Corporation
    Inventor: Tomoya SASAKI
  • Patent number: 11906702
    Abstract: An anti-glare film is prepared which have a ratio R/V of a scattered specular reflection intensity R to a total V of scattered reflection intensity being from 0.01 to 0.12 and an absolute value of a chromaticity b* of transmitted light being 3 or less. The anti-glare film includes a transparent substrate layer, and an anti-glare layer formed on at least one surface of the transparent substrate layer. The anti-glare layer may be a cured product of a curable composition including one or more types of a polymer component and one or more types of a curable resin precursor component, and in particular, at least two components selected from a polymer component and a curable resin precursor component can be phase separated through liquid phase spinodal decomposition. This anti-glare film can achieve non-coloring properties and anti-glare properties in a compatible manner.
    Type: Grant
    Filed: September 21, 2018
    Date of Patent: February 20, 2024
    Assignee: DAICEL CORPORATION
    Inventors: Yoshitaka Sugawara, Masaki Hayashi
  • Patent number: 11905393
    Abstract: An object of the present invention is to provide a cellulose acetate composition with excellent biodegradability and water solubility, and excellent thermoformability. A cellulose acetate composition comprising: a cellulose acetate having a degree of acetyl substitution of 0.4 or greater and less than 1.4; and a citrate ester-based plasticizer, wherein a content of the citrate ester-based plasticizer is 3 parts by weight or greater per 100 parts by weight of the total amount of the cellulose acetate and the citrate ester-based plasticizer.
    Type: Grant
    Filed: July 18, 2019
    Date of Patent: February 20, 2024
    Assignee: DAICEL CORPORATION
    Inventors: Kyokutou Ga, Masahiko Suzuki
  • Publication number: 20240051488
    Abstract: The present disclosure provides an occupant protection system protecting an occupant in a vehicle by a protection device provided in the vehicle the occupant protection system having a gas generator, a prediction unit, and a control unit.
    Type: Application
    Filed: April 21, 2020
    Publication date: February 15, 2024
    Applicant: Daicel Corporation
    Inventor: Masayuki Yamazaki
  • Patent number: 11896043
    Abstract: Object of the present invention is to provide an intestinal immune-enhancing agent that can sufficiently increase IgA in the intestinal tract with a low dose while maintaining an increased amount of IgA for an extended period of time. Provided is an intestinal immune-enhancing agent containing a cellulose acetate that has a total degree of acetyl substitution from 0.4 to 1.1.
    Type: Grant
    Filed: September 15, 2021
    Date of Patent: February 13, 2024
    Assignee: DAICEL CORPORATION
    Inventors: Tadashi Takeuchi, Eiji Miyauchi, Shu Shimamoto, Akinobu Matsuyama, Hiroshi Ohno
  • Patent number: 11898057
    Abstract: The purpose of the present invention is to provide a weather-resistant hard coat composition for a glass-substitute substrate capable of efficiently forming a coating film excelling in weather resistance, scratch resistance, and toughness. The present invention provides: a weather-resistant hard coat composition for a glass-substitute substrate, the composition containing a polyorganosilsesquioxane having a constituent unit represented by Formula (1); a cured product thereof; and a laminate having a glass-substitute substrate and a coating film formed on at least one surface of the glass-substitute substrate. The coating film is a layer of a cured product of the weather-resistant hard coat composition for a glass-substitute substrate. [In formula (1), R1 represents a group containing an active energy ray-curable functional group.
    Type: Grant
    Filed: November 20, 2019
    Date of Patent: February 13, 2024
    Assignee: DAICEL CORPORATION
    Inventors: Kunio Shimizu, Hiroshi Takahashi, Akihiro Shibamoto
  • Publication number: 20240043605
    Abstract: Provided is a curable composition that can form a lens having excellent visibility, antiglare effects, and contrast-enhancing effects by suppressing thermal degradation of a tetraazaporphyrin compound. The curable composition according to the present disclosure includes silsesquioxane containing a cyclohexene oxide group, and a tetraazaporphyrin compound having an absorption peak in a wavelength region of from 570 to 605 nm, in which a content of the tetraazaporphyrin compound is from 1000 to 10000 ppm by weight of a content of the silsesquioxane.
    Type: Application
    Filed: January 20, 2022
    Publication date: February 8, 2024
    Applicant: DAICEL CORPORATION
    Inventors: Akihiro SHIBAMOTO, Takashi YOSHIMURA, Yukio ASAI
  • Publication number: 20240044722
    Abstract: The present invention provides a temperature-sensitive probe containing a group 14 element-doped nanodiamond having an average particle size of 1 to 100 nm and including SiV centers.
    Type: Application
    Filed: December 23, 2021
    Publication date: February 8, 2024
    Applicants: DAICEL CORPORATION, Kyoto University
    Inventors: Masahiro NISHIKAWA, Ming LIU, Norikazu MIZUOCHI, Izuru OHKI, Masanori FUJIWARA
  • Publication number: 20240034832
    Abstract: [Problem] To provide a curable composition capable of achieving reduction in viscosity while having a high refractive index when formed into a cured product. [Solution] Disclosed is a curable composition containing an alicyclic epoxy compound (A) and a cationically polymerizable compound (B) having a binaphthyl group. The curable composition preferably contains a monofunctional cationically polymerizable aromatic compound (C), preferably has a viscosity of 30 Pa·s or less at 25° C., and preferably has a refractive index of 1.58 or greater at a wavelength 589 nm when cured.
    Type: Application
    Filed: July 26, 2023
    Publication date: February 1, 2024
    Applicant: DAICEL CORPORATION
    Inventors: Hiroki TAKENAKA, Kouji TANAKA
  • Publication number: 20240038951
    Abstract: There are provided a mounted structure from which such a mounted structure can be obtained that is excellent in precision with little joining deviation and can be efficiently produced, an LED display, and a mounting method. A mounted structure is provided in which a semiconductor element including a terminal is mounted on a substrate including an electrode. The mounted structure includes a joining portion in which the terminal and the electrode are joined opposing each other. The electrode is a bump of a bulk metal material disposed on the substrate. The joining portion is produced by thermally fusing metal nanoparticles, the metal nanoparticles being deposited from a metal complex by laser irradiation, the metal complex having been transferred onto at least one of the electrode or the terminal by using a microcontact printing method.
    Type: Application
    Filed: September 2, 2021
    Publication date: February 1, 2024
    Applicant: DAICEL CORPORATION
    Inventor: Hiroto MIYAKE
  • Patent number: 11884617
    Abstract: Provided is an acetic acid production method that enables smooth reduction and/or increase of acetic acid production with easy operation and can industrially efficiently, stably produce acetic acid with maintained quality even when the acetic acid production volume is changed. The acetic acid production method includes a carbonylation step in which methanol is reacted with carbon monoxide in a continuous system in the presence of a catalytic system, acetic acid, methyl acetate, and water, where the catalytic system includes a metal catalyst and methyl iodide. The carbonylation step employs two or more reactors disposed in parallel.
    Type: Grant
    Filed: July 2, 2018
    Date of Patent: January 30, 2024
    Assignee: DAICEL CORPORATION
    Inventor: Masahiko Shimizu
  • Patent number: 11887975
    Abstract: Provided is a semiconductor device manufacturing method in which semiconductor elements are formed into multiple layers through the lamination of wafers in which the semiconductor elements are fabricated, the method being suited for efficiently creating multiple layers of thin wafers while suppressing warping of a wafer laminate. The method of the present invention includes a preparation step, a thinning step, a bonding step, a removal step, and a multilayering step. In the preparation step, a reinforced wafer is prepared, the reinforced wafer having a laminated structure that includes: a wafer including an element forming surface and a back surface opposite from the element forming surface; a supporting substrate; and a temporary adhesive layer for forming temporary adhesion, the temporary adhesive layer being provided between the element forming surface side of the wafer and the supporting substrate.
    Type: Grant
    Filed: October 18, 2019
    Date of Patent: January 30, 2024
    Assignee: DAICEL CORPORATION
    Inventor: Naoko Tsuji