Patents Assigned to Daido Tokyshuko Kabushiki Kaisha
  • Diffusion bonding method and diffusion bonding apparatus
    Patent number: 5975405
    Abstract: A diffusion bonding method has a step of adjusting ends of material to be bonded before bonding the material after setting the materials in the diffusion bonding apparatus, whereas a diffusion bonding apparatus has a mechanism for finishing ends of materials to be bonded so that both ends face parallel to each other.
    Type: Grant
    Filed: April 21, 1997
    Date of Patent: November 2, 1999
    Assignee: Daido Tokyshuko Kabushiki Kaisha
    Inventors: Masaki Tsuchiya, Takao Shimizu, Hiroaki Suzuki