Abstract: A tuning-fork type crystal resonator plate includes a base portion and a pair of leg portions protruding from the base portion in one direction. A groove and a bank portion are formed on at least one of main surfaces of each of the leg portions. The bank portion is formed accompanied by the formation of the groove, and a width of the bank portion differs along a width direction. The bank portion is constituted by a thick portion having a large width and a thin portion having a small width.

Abstract: A piezoelectric vibration piece has an inverted mesa-type structure, comprising a thinned portion serving as a vibration region at a central part of a piezoelectric plate; and a thickened portion formed all along or partly along perimeter of the thinned portion to reinforce the thinned portion. In the piezoelectric vibration piece, contact metals including a large number of discrete metallic thin films are provided on the whole surfaces of the piezoelectric plate. A piezoelectric vibration device comprises the piezoelectric vibration piece which is housed in a package, wherein extraction electrodes of the piezoelectric vibration piece are connected to internal terminals of the package through a conductive adhesive. These structural and technical advantages prevent undesirable flowage of the conductive adhesive before thermal curing. As a result, the piezoelectric vibration piece and the piezoelectric vibration device comprising the same successfully attain excellent vibration characteristics.

Abstract: The present invention relates to an electronic component package, an electronic component package sealing member, and a method for producing the electronic component package sealing member. A through hole 49 is formed in a base 4 so as to pass through between both main surfaces 42 and 43 of a base material of the base 4. An inner side surface 491 of the through hole 49 includes a curved surface 495 that expands outward in a width direction of the through hole 49.

Abstract: An optical low-pass filter (30) includes a vertically splitting birefringent plate (31), a 45° splitting birefringent plate (32), and a 135° splitting birefringent plate (33). The 45° splitting birefringent plate (32) and the 135° splitting birefringent plate (33) are adjacent to each other. The thickness of the 45° splitting birefringent plate (32) is approximately equal to the thickness of the 135° splitting birefringent plate (33). The thicknesses of the 45° splitting birefringent plate (32) and the 135° splitting birefringent plate (33) are each less than the thickness of the vertically splitting birefringent plate (31). The position (point Pal) of incidence of an incident beam (L) on the vertically splitting birefringent plate (31) overlaps with the approximate center of a square split pattern (points P11, P12, P13, and P14) when viewed from the incident beam side.

Abstract: A tuning fork type piezoelectric vibration piece 2 includes a base portion 25 in which a piezoelectric vibration substrate has a connection area with an external element, and a pair of leg portions 21, 22 projecting from a first end face of the base portion. The pair of leg portions has vibrating portions 212, 222 equipped with drive electrodes, wide weight portions 211, 221 formed at tip ends of the vibrating portions, and connecting portions 213, 223 between the vibrating portions and the weight portions. The connecting portions have widening sections whose width increases exponentially from the vibrating portions to the weight portions. The length of the widening sections is greater than their width. The weight portions have constant-width parts whose width is fixed from their connecting positions with the connecting portions. The weight portions are free of drive electrodes.

Abstract: A deviation in mounting a temperature sensor unit is eliminated. In a second cavity 47 for mounting a temperature sensor unit 3 of a base 4, exposed electrodes 6 that intersect at least an internal wall surface 474 of a second wall portion 45 are formed so as to be exposed within the second cavity 47. The exposed electrodes 6 include a pair of temperature sensor electrode pads 621 and 622 to which the temperature sensor unit 3 is bonded via a solder 13. The solder 13 is formed so as to cover an entire surface of the exposed electrodes 6 including the temperature sensor electrode pads 621 and 622 to which the temperature sensor unit 3 is bonded.

Abstract: A crystal resonator includes: a crystal resonator plate; a first sealing member that covers a first excitation electrode of the crystal resonator plate; and a second sealing member that covers a second excitation electrode of the crystal resonator plate and includes a first external electrode terminal and a second external electrode terminal to be bonded to a circuit board using a flowable conductive bonding material. The second sealing member includes a second through hole and a third through hole that pass through between a first main surface and a second main surface on which the first external electrode terminal and the second external electrode terminal are formed. The second through hole and the third through hole include: respective through electrodes for conduction between electrodes formed on the first main surface and the second main surface; and respective through parts.

Abstract: A piezoelectric resonator device having a sandwich structure is provided, which can avoid gas generation with reduced size or height. A crystal resonator includes a crystal resonator plate, a first sealing member and a second sealing member. A sealing-member-side first bonding pattern and a sealing-member-side second bonding pattern, both to be bonded to the crystal resonator plate, are formed respectively on the first and second sealing members. On the crystal resonator plate, a resonator-plate-side first bonding pattern to be bonded to the first sealing member is formed on a first main surface and a resonator-plate-side second bonding pattern to be bonded to the second sealing member is formed on a second main surface. The sealing-member-side first bonding pattern is bonded to the resonator-plate-side first bonding pattern, and the sealing-member-side second bonding pattern is bonded to the resonator-plate-side second bonding pattern, both by diffusion bonding.

Abstract: A crystal resonator element 2 has excitation electrodes 23a, 23b formed on front and back main surfaces of a crystal resonator plate. Each of the excitation electrodes is made of a ternary alloy containing silver as a major component, a first additive, and a second additive. The first additive is a metal element having a lower sputtering yield than silver and being resistant to corrosion in an etching liquid. The second additive is an element for forming a solid solution with silver. Outer peripheries of the excitation electrodes are first additive-rich regions 9 in which the first additive is rich.

Abstract: A manufacturing method for a piezoelectric resonator device includes sequential steps of: (i) laminating a metal film constituted by at least two types of metals on at least one of a substrate of a joining region of a piezoelectric resonator plate, a substrate of a region of an upper lid member, and a substrate of a region of a lower lid member; (ii) promoting metal diffusion inside the metal film by heat processing; and (iii) roughening a surface of the substrate of the at least one of the piezoelectric resonator plate, the upper lid member, and the lower lid member by performing wet etching with an etchant caused to penetrate into the metal film and thereby forming a large number of micropores in the surface of the substrate of the at least one of the piezoelectric resonator plate, the upper lid member, and the lower lid member.

Abstract: For a tuning-fork type crystal resonator plate, a crystal plate having a crystal orientation is used. The tuning-fork type crystal resonator plate includes: a base portion; and a pair of first and second leg portions protruding from the base portion in one direction. In the first leg portion and the second leg portion, grooves are formed so that each of the grooves is biased relative to a center of the corresponding first or second leg portion in a width direction. A lowermost point of the groove is positioned in a middle of the groove in the width direction (width direction of the first leg portion and the second leg portion) in a state viewed from an end surface of the first and second leg portions in the width direction.

Abstract: In an electronic-component package made up of a laminated-ceramic, cavity-forming base and an electroconductive lid that is hermetically bonded to the base by a heat-melting sealant, contamination of electromagnetic-interference-reducing grounding metallization lines by melted sealant is prevented. A wall-portion grounding metallization line partially embedded in an enclosing wall portion of the base, and partially exposed to the package cavity, electrically connects lid, when sealant-bonded to the wall portion of the base, with a grounding external terminal on the base exterior. An electronic-component grounding metallization line exposed in the bottom of the base is connected to the grounding external terminal. A connecting portion that joins the wall-portion and electronic-component grounding metallization lines is disposed between laminations of the bottom and wall portions of the base, where the connecting portion is unexposed to the package cavity.

Abstract: A tuning fork type piezoelectric vibration piece 2 includes a base portion 25 in which a piezoelectric vibration substrate has a connection area with an external element, and a pair of leg portions 21, 22 projecting from a first end face of the base portion. The pair of leg portions has vibrating portions 212, 222 equipped with drive electrodes, wide weight portions 211, 221 formed at tip ends of the vibrating portions, and connecting portions 213, 223 between the vibrating portions and the weight portions. The connecting portions have widening sections whose width increases exponentially from the vibrating portions to the weight portions. The length of the widening sections is greater than their width. The weight portions have constant-width parts whose width is fixed from their connecting positions with the connecting portions. The weight portions are free of drive electrodes.

Abstract: A piezoelectric oscillator has an insulating base having a housing portion where internal terminal pads are formed, an integrated circuit (IC) element having rectangular pads bonded to the internal terminal (IT) pads, and a piezoelectric oscillation element (POE) connected to the base and IC element. The IT pads include two opposing first IT pads connected to the POE, two opposing second IT pads, one of which is for AC output, and two opposing third IT pads formed between the first IT pads and the second IT pads. Along a part of perimeter of the first IT pads, the third IT pads and wiring patterns which respectively extend the third IT pads are formed as conductive paths for blocking radiation noise. The first IT pads and the second IT pads are spaced apart with the conductive paths interposed therebetween.

Abstract: A piezoelectric resonator plate includes at least a pair of excitation electrodes and at least a pair of extraction electrodes. The pair of extraction electrodes are respectively extracted from the pair of excitation electrodes to electrically and mechanically bond the pair of excitation electrodes to an external electrode. The pair of extraction electrodes each include a distal end portion. The distal end portion includes a connecting electrode extracted to a vicinity of one end portion on one principal surface of the piezoelectric resonator plate. The connecting electrodes each include a top surface where a first metal film to be bonded to the external electrode is formed. The first metal film includes a top surface with two or more protruding portions. The first metal film has a larger surface roughness and a smaller area compared with the respective connecting electrodes. The protruding portions are formed with cross-sections in curvature shapes.

Abstract: [Solving means] In a package member assembly, a plurality of package members are integrally formed. The package member assembly includes a plurality of bottomed holes provided on a front main face and a back main face of a wafer made of glass, and external terminals connected to side-face conductors attached to inner wall faces of the bottomed holes on the back main face.

Abstract: A sealing member for an electronic component package includes, on another principal surface of a base material constituting the sealing member for the electronic component package, an external terminal electrode, a wiring pattern, and a resin material. The external terminal electrode is to be electrically coupled to an outside of the electronic component package. The wiring pattern is configured to couple an electronic component element on one principal surface of the base material to the external terminal electrode. The resin material is layered over the other principal surface and the wiring pattern. The external terminal electrode is layered over the wiring pattern and the resin material.

Abstract: An AT-cut quartz plate having chamfered ridge portions and an almost rectangular shape in planar view, wherein a resonance frequency is equal to or larger than 7 MHz and equal to or smaller than 9 MHz, lengths of long and short sides of the rectangular shape are equal to or larger than 1.5 mm and equal to or smaller than 2.4 mm, and equal to or larger than a frequency difference between primary vibration and sub-vibration is equal to or larger than 975 kHz and equal to or smaller than 1,015 kHz.