Abstract: A flex-rigid printed wiring board is provided which can retain flexibility of a flexible portion while increasing durability of the flexible portion against folding, and can ensure conduction in a rigid portion, and a method of manufacturing the printed wiring board. The flex-rigid printed wiring board includes a conductor layer provided on at least one face of a base film, one region of the wiring board containing the base film being a rigid region, an another region containing the base film being a flexible region. The average thickness “tf” of the conductor layer on the base film formed in the flexible region and the average thickness “tR” of the conductor layer on the base film formed in the rigid region satisfy the relationship of tf<tR.

Abstract: Adhesiveness between a wiring layer and a resin layer is improved by forming a nitrided resin layer by nitriding a surface of a substrate by plasma, and furthermore, thinly forming a copper nitride film prior to forming a copper film.

Abstract: A flex-rigid printed wiring board is provided which can retain flexibility of a flexible portion while increasing durability of the flexible portion against folding, and can ensure conduction in a rigid portion, and a method of manufacturing the printed wiring board. The flex-rigid printed wiring board includes a conductor layer provided on at least one face of a base film, one region of the wiring board containing the base film being a rigid region, an another region containing the base film being a flexible region. The average thickness “tf” of the conductor layer on the base film formed in the flexible region and the average thickness “tR” of the conductor layer on the base film formed in the rigid region satisfy the relationship of tf<tR.

Abstract: A part cartridge for a mounter device used in a mounting process for mounting electronic parts on a substrate by heating the substrate to a predetermined temperature after the electronic parts are mounted on the substrate put on a conveying carrier by the mounter device, comprising holding part holding the substrate in the state of being fitted to the conveying carrier, and a guide tape holding the holding part. The holding member is stored in the state of being wound together with the guide tape so that the holding part can be mounted on the conveying carrier by the mounter device. By this, a method of holding and carrying the substrate for mounting the holding part on the conveying carrier by using the mounter device can be adopted in the mounting process. The deflection of the substrate in reflow can be securely prevented while suppressing cost by effectively utilizing the existing mounting line and devices.

Abstract: A flex-rigid printed wiring board is provided which can retain flexibility of a flexible portion while increasing durability of the flexible portion against folding, and can ensure conduction in a rigid portion, and a method of manufacturing the printed wiring board. The flex-rigid printed wiring board includes a conductor layer provided on at least one face of a base film, one region of the wiring board containing the base film being a rigid region, an another region containing the base film being a flexible region. The average thickness “tf” of the conductor layer on the base film formed in the flexible region and the average thickness “tR” of the conductor layer on the base film formed in the rigid region satisfy the relationship of tf<tR.

Abstract: A jig for holding and conveyance includes a plate having a weak-adherence adhesive pattern on a surface and a printed circuit board having a conductive portion and a non-conductive portion on the surface of an insulating substrate. The weak-adherence adhesive pattern is formed at a position corresponding to the non-conductive portion. Alternatively, the weak-adherence adhesive pattern subjected to surface roughening is formed on a surface of the weak-adhesive layer at a position corresponding to the conductive portion.

Abstract: A flex-rigid printed wiring board is provided which can retain flexibility of a flexible portion while increasing durability of the flexible portion against folding, and can ensure conduction in a rigid portion, and a method of manufacturing the printed wiring board. The flex-rigid printed wiring board includes a conductor layer provided on at least one face of a base film, one region of the wiring board containing the base film being a rigid region, an another region containing the base film being a flexible region. The average thickness “tf” of the conductor layer on the base film formed in the flexible region and the average thickness “tR” of the conductor layer on the base film formed in the rigid region satisfy the relationship of tf<tR.

Abstract: A part cartridge for a mounter device used in a mounting process for mounting electronic parts on a substrate by heating the substrate to a predetermined temperature after the electronic parts are mounted on the substrate put on a conveying carrier by the mounter device, comprising holding part holding the substrate in the state of being fitted to the conveying carrier, and a guide tape holding the holding part. The holding member is stored in the state of being wound together with the guide tape so that the holding part can be mounted on the conveying carrier by the mounter device. By this, a method of holding and carrying the substrate for mounting the holding part on the conveying carrier by using the mounter device can be adopted in the mounting process. The deflection of the substrate in reflow can be securely prevented while suppressing cost by effectively utilizing the existing mounting line and devices.

Abstract: A part cartridge for a mounter device used in a mounting process for mounting electronic parts on a substrate by heating the substrate to a predetermined temperature after the electronic parts are mounted on the substrate put on a conveying carrier by the mounter device, comprising holding part holding the substrate in the state of being fitted to the conveying carrier, and a guide tape holding the holding part. The holding member is stored in the state of being wound together with the guide tape so that the holding part can be mounted on the conveying carrier by the mounter device. By this, a method of holding and carrying the substrate for mounting the holding part on the conveying carrier by using the mounter device can be adopted in the mounting process. The deflection of the substrate in reflow can be securely prevented while suppressing cost by effectively utilizing the existing mounting line and devices.

Abstract: A part cartridge for a mounter device used in a mounting process for mounting electronic parts on a substrate by heating the substrate to a predetermined temperature after the electronic parts are mounted on the substrate put on a conveying carrier by the mounter device, comprising holding part holding the substrate in the state of being fitted to the conveying carrier, and a guide tape holding the holding part. The holding member is stored in the state of being wound together with the guide tape so that the holding part can be mounted on the conveying carrier by the mounter device. By this, a method of holding and carrying the substrate for mounting the holding part on the conveying carrier by using the mounter device can be adopted in the mounting process. The deflection of the substrate in reflow can be securely prevented while suppressing cost by effectively utilizing the existing mounting line and devices.