Abstract: A method for manufacturing a wiring board or a wiring board material includes: obtaining a laminated body LB including the wiring board or the wiring board material having an opening, an embedded member 14 positioned inside the opening, and a cured product of a filling sheet or a coating layer that is integrated with the wiring board or the wiring board material and contains a thermosetting resin 17, the thermosetting resin 17 being filled between an inner surface of the opening of the wiring board or the wiring board material and the embedded member; and removing the cured product of the filling sheet or the coating layer by grinding to obtain a constant thickness of the laminated body.

Abstract: Provide are a method for manufacturing a wiring board or a wiring board material, and the wiring board obtained by the method, which allows columnar metal members to be inserted into the wiring board at once using a simple operation, enables alignment without requiring strict accuracy, can handle columnar metal members having different shapes, and imparts sufficiently high adhesive strength to the columnar metal members.

Abstract: Provide are a method for manufacturing a wiring board or a wiring board material, and the wiring board obtained by the method, which allows columnar metal members to be inserted into the wiring board at once using a simple operation, enables alignment without requiring strict accuracy, can handle columnar metal members having different shapes, and imparts sufficiently high adhesive strength to the columnar metal members.

Abstract: Provided is a mat which is capable of significantly contributing to sound and healthy life environment, and particularly capable of effectively reducing energy of electromagnetic waves, vibrations, sounds, impacts, radiations and so on and which has excellent antibacterial properties, antiviral properties, anti-allergen properties and deoderization properties. The mat (11) is a mat with a backing layer (13) formed on the back surface side of a fiber surface layer (12), wherein at least one of the fiber surface layer (12) and the backing layer (13) contains an organic attenuating filler (marked as ?), a radiation reduction filler (marked as ?), an iodine-based compound (marked as ?) and an allergen reduction filler (marked as ?).

Abstract: A method of manufacturing a multilayer wiring board comprising a step of forming an upper wiring layer (27), a part thereof being electrically connected to a pillar-shaped metallic body (24a), after he pillar-shaped metal body (24a) is formed on a lower wiring layer (22) is characterized in that the step of forming the metallic body includes a sub-step of forming a plating layer (24) constituting the metallic body, a sub-step of forming a mask layer (25) on the surface where the metal body is formed, of the plating layer, and a sub-step of etching the plating layer. The manufacture can be carried out with simple equipment combination of conventional steps and the wiring layer can be made fine.

Abstract: In a method of manufacturing a multilayer wiring board according to the present invention having the step of after forming a column-like metallic body on a lower wiring layer, forming an upper wiring layer whose part is conductively connected with the column-like metallic body, the column-like metallic body is formed by the step of coating the lower wiring layer with a conductor showing durability at the time of etching metal composing the column-like metallic body so as to form a conductive layer, the step of forming a plating layer of the metal composing the column-like metallic body on a whole surface including the conductive layer, the step of forming a mask layer on a surface portion of the plating layer where the column-like metallic body is formed, and the step of etching the plating layer. The present invention can provide the method of manufacturing a multilayer wiring board which can form the column-like metallic body having uniform height for short time according to a simple and low-priced method.

Abstract: An organic waste decomposition treatment apparatus, wherein agitation vanes of flight members are rotatably attached to looped chains, so as to churn and ferment organic waste accumulated within a reservoir vat when the chain is rotationally driven, then be pushed towards an interior of the agitator by a push-down scraper which is positioned outside of the agitator at a back side of the agitator with respect to the direction of advancement, so as to eliminate contact resistance between the agitator and the organic waste at the back side of the agitator. It is thereby possible to make the agitator smaller and less expensive, and the decomposition treatment efficiency of organic waste is able to be increased.

Abstract: This invention relates to an antistatic mat for a vehicle, and especially relates to an antistatic mat equipped with electric discharge function against generation of static electricity for effectively preventing adhesion of dust and rubbish thereon and secondary disaster caused by electric shock. An antistatic mat according to Claim 1 is characterized in that it includes: pile including conductive fibers containing conductive components partially protruding from the surface of synthetic resin. An antistatic mat according to Claim 2 is characterized in that it includes conductive compound fibers wound around non-conductive fibers forming pile in the manner that each conductive fiber is wound around the periphery of each non-conductive fiber to form a spiral shape. An antistatic mat according to Claim 3 is characterized in that it includes conductive compound fibers mixed to the bundle of non-conductive fibers forming pile.