Abstract: The thick film delay line of the present invention comprises a substrate having a plurality of conductive pads mounted along the edge thereof. A plurality of delay circuit assemblies are stacked on the upper surface of the substrate. Each delay circuit comprises a solid sheet of conductive material, a first layer of dielectric material superimposed over the solid conductor sheet, a spiral coil conductor having its opposite ends connected to two separate contact pads, and a second sheet of dielectric material covering the spiral conductor. The spiral conductors within each of the delay circuit assemblies are connected to one another in series.