Patents Assigned to Dale Scott & Co., Inc.
  • Patent number: 8533093
    Abstract: A new type of general obligation bond, called Ed-Tech bonds, is structured to provide on-going funding for a district's technology needs, match the term of the underlying bonds to the useful short-term life of technology assets to be purchased with bond proceeds, and address federal restrictions regarding use of bond proceeds. Further, techniques are described for determining the appropriate financing parameters for the Ed-Tech bonds.
    Type: Grant
    Filed: September 7, 2012
    Date of Patent: September 10, 2013
    Assignee: Dale Scott & Co., Inc.
    Inventor: Dale Scott