Patents Assigned to Dan Clark Audio, Inc.
  • Headphone pad mounting system
    Patent number: 11252495
    Abstract: A headphone may employ an ear pad mounted to a housing. Affixing a soft sticky or tacky non-adhesive polymer base to the underside of a headphone ear pad allows easy attachment of ear pads to a headphone with the ability to frequently and non-destructively swap pads, without the weight, bulk and fragility of other pad attachment mechanisms.
    Type: Grant
    Filed: February 4, 2020
    Date of Patent: February 15, 2022
    Assignee: Dan Clark Audio, Inc.
    Inventors: Daniel William Clark, Robert Jason Egger