Patents Assigned to DANanoMaterials LLC
  • Compositions for chemical mechanical planarization of tantalum and tantalum nitride
    Patent number: 7033409
    Abstract: The present invention relates to compositions for the chemical mechanical planarization (“CMP”) of barrier/adhesion layers, particularly Ta/TaN barrier/adhesion layers as occur in the manufacture of integrated circuits. CMP compositions comprise an aqueous solution of oxidizer and colloidal silica abrasive. Oxidizers include hydroxylamine nitrate, nitric acid, benzotriazole, ammonium nitrate, aluminum nitrate, hydrazine and mixtures thereof in aqueous solution.
    Type: Grant
    Filed: September 22, 2003
    Date of Patent: April 25, 2006
    Assignee: DANanoMaterials LLC
    Inventors: Robert J. Small, Maria Peterson, Tuan Truong, Melvin Keith Carter, Lily Yao