Patents Assigned to Danfoss Silison Power GmbH
  • Publication number: 20070210445
    Abstract: The invention relates to a power semiconductor module comprising a plurality of power semiconductors that are fixed to a first side of a printed circuit board (26), and a cooling device that acts by means of a coolant, on a second side of the printed circuit board (26), opposite the first side, the cooling device comprising a plurality of cells through which the coolant is guided. The aim of the invention is to minimise the risk of failure of one such power semiconductor module. To this end, a non-cooled region (d, e, f is arranged between at least two cells.
    Type: Application
    Filed: May 24, 2005
    Publication date: September 13, 2007
    Applicant: Danfoss Silison Power GmbH
    Inventors: Klaus Olesen, Ronald Eisele