Patents Assigned to Daouincube, Inc.
  • THREE DIMENSIONAL (3D) VIRTUAL IMAGE MODELING METHOD FOR OBJECT PRODUCED THROUGH SEMICONDUCTOR MANUFACTURING PROCESS
    Publication number: 20160253449
    Abstract: A three dimensional (3D) virtual shape modeling method for an object produced through a semiconductor process is provided, which can model a 3D shape of an object produced through processes such as deposition, etching, and so on that are used in a semiconductor or planar display panel manufacturing process. Specifically, convenient modeling can be performed when forming a layer produced through deposition and then etching on a non-flat, preceding layer, by using two dimensional projection method.
    Type: Application
    Filed: February 24, 2016
    Publication date: September 1, 2016
    Applicant: Daouincube, Inc.
    Inventors: Tae Hwa LIM, Dong Wan KANG, Hyun Cheol KIM