Patents Assigned to Datapaq Limited
  • Publication number: 20020189058
    Abstract: A sensor clip for positioning a sensor relative to a substrate, particularly but not exclusively a temperature sensor (e.g. a thermocouple) used to obtain a temperature profile of a part of the substrate or surrounding environment as it passes through an industrial oven. The sensor clip comprises a first part and a second part slidably mounted with respect to the first part, the parts defining a pair of jaws having opposed surfaces for engaging sides of the substrate, with jaw separation being determined by linear movement of one part relative to the other.
    Type: Application
    Filed: January 14, 2002
    Publication date: December 19, 2002
    Applicant: Datapaq Limited
    Inventors: Ian Budden, Stephen George Offley, David Eric Bull
  • Patent number: D298137
    Type: Grant
    Filed: October 22, 1985
    Date of Patent: October 18, 1988
    Assignee: Datapaq Limited
    Inventor: Alexander J. Bates