Patents Assigned to Datapaq, Ltd.
  • Patent number: 11566923
    Abstract: A thermal protection system includes a housing, an interior cavity, and a thermal barrier within the housing. The thermal barrier includes a compartment containing an insulating medium, and is disposed around at least a part of the interior cavity to maintain a temperature of the interior cavity within a first temperature range. A pressure relief valve arranged at least partially within the housing is in fluid communication with the insulated compartment and permits a fluid, such as air, within the compartment to pass to the environment outside of the compartment when a fluid pressure within the compartment exceeds a predetermined pressure. The compartment is sealed from the environment except for the fluid communication via the pressure relief valve. The pressure relief valve is coupled to a thermally-protected mounting within the housing that maintains a temperature of an operative portion of the pressure relief valve within a second temperature range.
    Type: Grant
    Filed: November 17, 2021
    Date of Patent: January 31, 2023
    Assignee: Datapaq Ltd.
    Inventors: Stewart Griffiths, Marie Y. Murray
  • Patent number: 4817049
    Abstract: A data logging device has a data memory unit (11) and a transducer interface unit (1). The data memory unit has an internal power source (12), an integrated circuit memory component (23) for storing data under the control of a microprocessor (18) in the memory unit, light emitting diodes (14, 21) for indicating the amount of data stored in the memory component and the power source state. A connector component (19) connects the memory component to receive data from the transducer interface unit. The transducer interface unit (1) has a plurality of ports (2) for connection of remote transducers and an analog to digital converter (5) for translating signals received from the ports into data signals which can be transferred to the memory component in the data memory unit through a connector component (9) connected to the connector component (19) of the data memory unit.
    Type: Grant
    Filed: April 24, 1986
    Date of Patent: March 28, 1989
    Assignee: Datapaq, Ltd.
    Inventors: Alexander J. Bates, John R. Wells, Ronald A. Shapiro, Richard L. Tenney