Patents Assigned to Datavan Internatoinal Corp.
  • Patent number: 7064954
    Abstract: A mainframe cooling structure is disclosed to include a body, which has a side cover and a ventilation grille at the side cover for letting air in and out, a circuit board, which is fixedly mounted inside the body and has an electronic device that produces heat during operation, and a cooler module, which includes a heat sink attached to the electronic device, a fan holder provided at the top side of the heat sink, and two fans mounted in the fan holder and aimed at different parts of the ventilation grille for drawing outside cooling air toward the heat sink and drawing inside hot air out of the body.
    Type: Grant
    Filed: April 19, 2005
    Date of Patent: June 20, 2006
    Assignee: Datavan Internatoinal Corp.
    Inventors: Chia-Chuan Wu, Chia-Yen Hsu, Chuan-Chun Chiu