Abstract: A bonding-option architecture is provided for use on an IC package for bonding option selections. The bonding-option architecture includes an option pad and a plurality of bonding entries connected to the option pad, each of the bonding entries being arranged in immediate proximity to one of the bonding points. In this bonding-option architecture, at least a first one of the bonding points is connected via a first one of the pins to an external power point and at least a second one of the bonding points is connected via a second one of the pins to an external ground point when the IC package is mounted on a circuit board.

Abstract: A voltage controlled oscillator (VCO) is provided which can minimize the frequency shift and phase disturbance caused by noise in the input voltage to the VCO. The VCO includes a voltage-to-current converting unit, receiving the input voltage, for generating a bias voltage. A ring-oscillating unit including an odd number of cascaded ring oscillator stages (ROSC) is coupled to the voltage-to-current converting unit for generating an oscillating signal. A bias unit is coupled to the ring-oscillating unit for generating a stable DC bias voltage for the ring-oscillating unit. A current adjustment unit is coupled to the voltage-to-current converting unit and the ring-oscillating unit, which can generate a working current in response to the bias voltage for the ring-oscillating unit.