Patents Assigned to DAVID et al
  • Utility wafer for chemical mechanical polishing
    Publication number: 20020028635
    Abstract: A utility wafer, more specifically, an utility wafer for simulating a workpiece in a semiconductor processing system. The utility wafer includes a first side, a second side and a peripheral edge wherein one or both edges of the peripheral edge are relieved to remove the otherwise sharp edge. In one embodiment, the peripheral edge is polished. The utility wafer is resistant to chipping, stress cracking and breakage when undergoing chemical mechanical planarization.
    Type: Application
    Filed: April 6, 2000
    Publication date: March 7, 2002
    Applicant: DAVID et al
    Inventors: Jeffrey D. David, Benjamin A. Bonner, Thomas H. Osterheld, Sidney Huey